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Product Detailed Parameters
- Description：IC RF TXRX BLE 68HVQFN
- Series：-
- Mfr：NXP Semiconductors
- Package：Bulk
- Type：TxRx Only
- RF Family/Standard：Bluetooth, WiFi
- Protocol：802.11a/b/g/-c, Bluetooth v5.2
- Modulation：-
- Frequency：2.4GHz, 5GHz
- Data Rate (Max)：433Mbps
- Power - Output：13dBm
- Sensitivity：-99dBm
- Memory Size：-
- Serial Interfaces：GPIO, JTAG, PCM, SDIO, UART
- Voltage - Supply：1.1V, 1.8V, 2.2V
- Current - Receiving：-
- Current - Transmitting：-
- Operating Temperature：-40°C ~ 105°C
- Mounting Type：Surface Mount
- Package / Case：68-VFQFN Exposed Pad
- Supplier Device Package：68-HVQFN (8x8)
- GPIO：21
- Grade：-
- Qualification：-
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Overview
The NXP 88W8987SA2-NYEA/BK is a highly integrated RF System on Chip (SoC) supporting 1x1 Wi-Fi 5 (802.11ac Wave 2) and Bluetooth 5.2. It operates in dual-band frequencies of 2.4 GHz and 5 GHz, delivering a maximum data rate of 433 Mbps. The component utilizes a QFN-68 package with SMD/SMT mounting style. Key interfaces include PCM, SDIO, and UART for host connectivity.
Feature Summary
- Integrates dual-band Wi-Fi and Bluetooth 5.2 capabilities into a single silicon solution.
- Supports high-speed 802.11ac Wave 2 connectivity for reliable wireless performance.
- Features low power consumption suitable for compact IoT device designs.
Applications
- Smart home devices requiring combined Wi-Fi and Bluetooth connectivity
- IoT sensors and actuators needing efficient wireless communication
- Portable consumer electronics utilizing compact RF solutions
Procurement Notes
Verify the specific ordering suffix to ensure correct packaging and regional compliance specifications. Confirm interface compatibility with the target host system prior to integration. Check current availability status as supply levels may fluctuate. Ensure ESD handling procedures are followed during assembly due to the sensitive RF nature of the component.
Selection Notes
Select this SoC when a compact form factor is required for simultaneous Wi-Fi and Bluetooth operations. It is suitable for applications demanding 802.11ac Wave 2 speeds without external transceivers. Consider the QFN-68 package constraints for PCB layout. Evaluate thermal management requirements given the integrated nature of the radio components within the small footprint.
Part Context
This component belongs to the NXP 88W8987 series, designed for cost-effective wireless connectivity. It replaces discrete Wi-Fi and Bluetooth chips by integrating both radios on one die. The series targets the growing market for connected IoT devices that require robust, standards-compliant wireless protocols in a minimal space.
Replacement Considerations
Direct substitutes include other variants within the 88W8987 family such as 88W8987-A2-NYE2A005, provided pinout and software compatibility are verified. Cross-model replacements should be evaluated based on specific interface needs and regulatory approvals for the target region.
