88W9064-A1-BWPC/AK

$25.67

Description：IC RF TXRX BLE WIFI
Series：-
Mfr：NXP Semiconductors
Package：Bulk

SKU:0edc72f5c396 Category: RF Transceiver ICs Brand: NXP Semiconductors

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Product introduction

Product Detailed Parameters

Description：IC RF TXRX BLE WIFI
Series：-
Mfr：NXP Semiconductors
Package：Bulk
Type：TxRx Only
RF Family/Standard：Bluetooth, WiFi
Protocol：802.11ax, Bluetooth v5.0
Modulation：1024QAM
Frequency：2.4GHz, 5GHz
Data Rate (Max)：2.4Gbps
Power - Output：-
Sensitivity：-
Memory Size：-
Serial Interfaces：GPIO, PCM, SPI, UART
Voltage - Supply：-
Current - Receiving：-
Current - Transmitting：-
Operating Temperature：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
GPIO：-
Grade：-
Qualification：-

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88W9064-A1-BWPC/AK

Overview

The NXP Semiconductors 88W9064-A1-BWPC/AK is a Mochi WiFi Access Point integrated circuit designed for high-performance wireless networking. It supports Bluetooth v5.0 and Wi-Fi 802.11ax standards across 2.4GHz and 5GHz frequency bands. The component utilizes an LFBGA358 package with 358 terminals, featuring a 0.65 mm pitch and dimensions of 15 mm x 15 mm x 1.21 mm. Interfaces include MCi, PCIe, and UART, facilitating robust connectivity for embedded systems.

Feature Summary

Supports Wi-Fi 802.11ax and Bluetooth v5.0 protocols
Dual-band operation at 2.4GHz and 5GHz frequencies
Integrated RF transceiver system on a chip architecture

Applications

Wireless access point implementations
IoT smart home devices
Industrial wireless connectivity solutions

Procurement Notes

Verify the specific ordering suffix against official NXP documentation to ensure correct packaging and configuration. Confirm that the LFBGA358 package variant matches the design-in requirements. Check for compliance with EU RoHS directives as indicated in distributor listings. Ensure interface compatibility with host systems supporting MCi, PCIe, or UART connections before procurement.

Selection Notes

Select this component for designs requiring integrated Wi-Fi 6 and Bluetooth capabilities within a compact form factor. The LFBGA358 package suits applications needing dense interconnects. Consider the dual-band support for versatile network deployment. Evaluate the MCU interface options for seamless integration into existing embedded architectures without additional external radio components.

Part Context

This part belongs to NXP's Mochi series of wireless connectivity solutions. It serves as a System on Chip (SoC) combining RF and baseband processing. The device targets developers seeking modular platforms for rapid prototyping in IoT and networking sectors, leveraging NXP's ecosystem of tools and software examples for embedded design simplification.

Replacement Considerations

Consult NXP official documentation for direct substitutes. Verify pinout and electrical parameter compatibility if considering alternative RF SoCs from other manufacturers. Ensure any replacement maintains support for 802.11ax and Bluetooth v5.0 standards.