89068416SP

Overview

The Hoffman Enclosures Inc. part number 89068416SP is a coil condenser designed for rack thermal management applications. This component functions as a heat exchange element within electrical enclosures, facilitating the transfer of thermal energy from internal components to the external environment. It serves as a critical accessory for maintaining optimal operating temperatures in enclosed industrial systems.

Feature Summary

• Supports enclosure airflow and heat removal
• Helps extend service life of internal components

Applications

• Rack thermal management
• Electrical enclosure cooling
• Industrial equipment heat dissipation

Procurement Notes

Verify the exact manufacturer part number 89068416SP against official nVent Hoffman documentation to ensure compatibility with specific enclosure models. Confirm that the unit is a genuine coil condenser intended for thermal management. Check for any specific mounting requirements or associated hardware needed for installation. Ensure the product matches the intended application for rack thermal management.

Selection Notes

Select this component when active thermal management is required for electrical enclosures housing heat-generating equipment. The coil condenser is suitable for applications where ambient air cooling is sufficient but requires enhanced heat transfer capabilities. Consider the physical dimensions and airflow requirements of the target enclosure to ensure proper integration and effective thermal performance.

Part Context

This item belongs to the nVent Hoffman line of enclosure accessories, specifically categorized under thermal management solutions. It is designed to complement Hoffman's range of industrial electrical enclosures by providing efficient heat rejection. The product supports the reliability of enclosed systems by preventing overheating of sensitive electronic and electrical components.

Replacement Considerations

Consult official nVent Hoffman catalogs for direct replacement part numbers. Verify dimensional and functional equivalence before substituting with generic thermal components. Ensure any alternative maintains the required heat dissipation capacity for the specific enclosure model.