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Product Detailed Parameters
- Description：CAP SILICON 1.5PF 20% 100V DIE
- Series：91
- Mfr：MACOM Technology Solutions
- Package：Bulk
- Capacitance：1.5 pF
- Tolerance：±20%
- Voltage - Breakdown：100 V
- ESL (Equivalent Series Inductance)：-
- Applications：-
- Features：High Reliability
- Operating Temperature：-55°C ~ 150°C
- Package / Case：Die
- Height：-
- Size / Dimension：-
- ESR (Equivalent Series Resistance)：-
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Overview
The MACOM 911R5M-BSP3 is a silicon binary capacitor die designed for high-frequency applications. It features a nominal capacitance of 1.5 pF with a tolerance of ±20% and a voltage rating of 100 V. The component is manufactured as a bare die, suitable for wire bonding integration into custom RF circuits. This device belongs to the BSP series, which facilitates breadboarding and trimming capabilities in microwave and millimeter-wave designs.
Feature Summary
- Wire-bondable silicon capacitor die structure
- Designed for trimming capability and breadboarding flexibility
- RoHS compliant construction
Applications
- Military RF circuit integration
- Commercial microwave system design
- Industrial high-frequency applications
Procurement Notes
Verify the specific suffix 'BSP3' against official MACOM documentation to confirm package type and marking details. Ensure compatibility with wire-bonding processes during integration. Confirm RoHS compliance status through current manufacturer declarations. Cross-reference part numbers with authorized distributors to avoid counterfeit components. Validate electrical parameters against the latest datasheet revision.
Selection Notes
Select this component when precise capacitance trimming or breadboarding flexibility is required in RF designs. Consider the bare die format for custom packaging solutions. Evaluate the 1.5 pF value and 100 V rating against circuit requirements. Assess wire-bonding compatibility with existing assembly processes. Compare performance characteristics with other BSP series variants for optimal fit.
Part Context
This component is part of MACOM's BSP series of binary capacitors, engineered for rugged operation in demanding environments. The series supports both military and commercial applications, offering reliable performance across temperature ranges. As a silicon-based device, it provides stable capacitance values suitable for high-frequency signal processing and tuning networks.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation. Consult MACOM technical support for direct equivalents or updated series replacements. Verify pinout and electrical specifications before substituting any alternative components.
