ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：DIE, CAPACITOR, 200 PF+/-10%
- Series：91
- Mfr：MACOM Technology Solutions
- Package：Bulk
- Capacitance：200 pF
- Tolerance：±10%
- Voltage - Breakdown：100 V
- ESL (Equivalent Series Inductance)：-
- Applications：-
- Features：High Reliability
- Operating Temperature：-55°C ~ 150°C
- Package / Case：Die
- Height：-
- Size / Dimension：-
- ESR (Equivalent Series Resistance)：-
Download product information
Overview
The MACOM Technology Solutions 91200RK-SP39 is a silicon chip capacitor designed for RF applications. It features a die package configuration suitable for wire bonding. The component provides a nominal capacitance of 200 pF with a tolerance of +/-10%. Constructed using silicon nitride and silicon dioxide dielectric layers, it ensures high reliability and stable capacitance performance over time. This part belongs to the MACOM 91 series of thin-film capacitors.
Feature Summary
- Utilizes silicon nitride/silicon dioxide dielectric layers for enhanced reliability
- Provides stable capacitance performance over extended operational periods
- Designed as a bare die for direct wire bonding integration
Applications
- RF circuit integration requiring stable capacitance
- Wire-bondable passive component implementation
- High-reliability thin-film capacitor applications
Procurement Notes
Verify the specific ordering suffix and die specifications against the official MACOM datasheet before procurement. Confirm that the wire-bondable die format aligns with your PCB assembly capabilities. Ensure compliance with RoHS status requirements, as indicated in current documentation. Cross-reference the manufacturer part number to avoid confusion with similar series components.
Selection Notes
Select this component when a stable, wire-bondable silicon capacitor is required for RF designs. The 200 pF value and +/-10% tolerance suit specific impedance matching or filtering needs. Consider the die package type for manufacturing compatibility. Evaluate the long-term stability provided by the silicon nitride/dioxide dielectric for critical signal paths.
Part Context
This component is part of the MACOM 91 series, which specializes in silicon RF capacitors. The series utilizes thin-film technology to deliver consistent electrical characteristics. The 91200RK-SP39 specifically addresses the need for reliable, small-form-factor passive components in advanced RF modules where traditional surface-mount packages may not be feasible.
Replacement Considerations
No public confirmed substitute part numbers are available in the provided documentation. Consult MACOM directly for potential alternatives if this specific die configuration is unavailable.
