913R0K

Overview

The MACOM 913R0K is a silicon chip capacitor designed for wire-bondable applications. It features a nominal capacitance of 3 pF with a tolerance of +/-10%. The component utilizes a dielectric structure suitable for high-frequency RF circuits. Packaged as a binary chip, it supports precise trimming capabilities and breadboarding requirements.

Feature Summary

• Wire-bondable construction for direct integration into RF modules
• Binary design facilitates breadboarding and circuit trimming
• High-precision 3 pF capacitance with tight tolerance

Applications

• RF module integration
• Breadboarding and prototyping
• Precision trimming applications

Procurement Notes

Verify the specific ordering suffix and packaging configuration directly with MACOM or authorized distributors. Confirm RoHS compliance status and moisture sensitivity level prior to procurement. Ensure the supplier provides valid traceability documentation for this binary chip capacitor variant.

Selection Notes

Select the 913R0K when a fixed 3 pF value with +/-10% tolerance is required in a wire-bondable format. This component is appropriate for designs needing manual adjustment or breadboard compatibility. Evaluate thermal stability and parasitic inductance against circuit requirements before finalizing the selection.

Part Context

MACOM Technology Solutions specializes in high-performance analog semiconductor products. The company offers a range of binary capacitors, including the BOO and BSP series, designed for flexibility in development and production environments. These components support rapid prototyping and precision tuning in RF systems.

Replacement Considerations

Consult MACOM official documentation for verified substitute part numbers within the 913R0K-BSP-3 or similar binary capacitor families. Cross-reference electrical specifications and physical dimensions to ensure compatibility.