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Product Detailed Parameters
- Description：DIE, BINARY CAPACITOR, 3.7 PF +/
- Series：91
- Mfr：MACOM Technology Solutions
- Package：Bulk
- Capacitance：3.75 pF
- Tolerance：±10%
- Voltage - Breakdown：100 V
- ESL (Equivalent Series Inductance)：-
- Applications：-
- Features：High Reliability
- Operating Temperature：-55°C ~ 150°C
- Package / Case：Die
- Height：-
- Size / Dimension：-
- ESR (Equivalent Series Resistance)：-
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Overview
The MACOM 913R7K-BSP-1 is a binary chip capacitor with a nominal capacitance of 3.7 picofarads and a tolerance of plus or minus ten percent. It is constructed as a die component, suitable for applications requiring trimming capability or breadboarding. The device operates within a temperature range of negative fifty-five degrees Celsius to one hundred fifty degrees Celsius and features a voltage breakdown rating of one hundred volts. This component is part of the BSP series designed for high reliability in semiconductor circuits.
Feature Summary
- Designed for trimming capability and breadboarding
- High reliability construction
- Wide operating temperature range
Applications
- RF circuit tuning
- Microwave signal conditioning
- Space-based communications platforms
Procurement Notes
Verify the specific ordering suffix and package configuration against the manufacturer's official datasheet to ensure compatibility with your design requirements. Confirm that the die format matches your assembly process. Check for RoHS compliance status if required by your supply chain standards. Ensure the voltage breakdown and temperature ratings meet your system's operational constraints before finalizing procurement.
Selection Notes
Select this component when precise capacitance adjustment is necessary during prototyping or production. Consider its die form factor for direct integration into custom substrates. Evaluate its high-temperature performance for demanding environments. Compare it with other binary capacitors in the series based on specific tolerance and breakdown voltage needs for optimal circuit performance.
Part Context
This part belongs to MACOM's binary chip capacitor series, which includes BOO and BSP variants. These components are engineered to facilitate easy breadboarding and provide trimming capabilities for fine-tuning circuit parameters. They are integral to MACOM's broader portfolio of RF, microwave, and millimeter-wave semiconductor solutions used in high-performance communication systems.
Replacement Considerations
Consult the official MACOM documentation for verified substitute part numbers within the 91xRxK series. Ensure any replacement maintains the same capacitance value, tolerance, and voltage breakdown rating. Verify package compatibility and temperature range specifications before substitution.
