9317CDM

Overview

The 9317CDM is a decoder/driver integrated circuit manufactured by Rochester Electronics, LLC. It is housed in a 16-lead Ceramic Dual In-Line Package (CDIP). The device is designed for TTL logic compatibility and functions as a high-speed optocoupler or driver within electronic circuits.

Feature Summary

• Provides signal isolation and decoding capabilities via internal optical coupling mechanisms.
• Engineered with TTL-compatible input thresholds to interface directly with standard digital logic families.
• Constructed using ceramic dual in-line packaging to ensure mechanical robustness and thermal stability.

Applications

• Industrial control systems requiring isolated signal transmission
• TTL logic interface circuits
• Decoder applications in legacy hardware maintenance

Procurement Notes

Verify the specific manufacturing lot and date code against project requirements, as Rochester Electronics supplies components from various original manufacturers. Confirm that the 16-CDIP package matches the target PCB footprint. Ensure the device meets the required environmental specifications for the intended operational temperature range before integration into the final assembly.

Selection Notes

Select this component when a TTL-compatible decoder or driver is needed in a hermetically sealed ceramic package. It serves as a suitable replacement for obsolete original manufacturer parts in existing designs. Verify that the pinout and electrical characteristics align with the original schematic requirements to ensure seamless integration without redesigning the host board.

Part Context

Rochester Electronics, LLC specializes in providing long-life semiconductor solutions, including obsolescence management and lifecycle support. The company sources, tests, and distributes components from multiple original equipment manufacturers. This part falls under their portfolio of discrete and linear ICs, supporting industries that require reliable supply chains for critical infrastructure and industrial applications.

Replacement Considerations

Cross-reference with original manufacturer datasheets to confirm pinout compatibility. Verify that the ceramic package dimensions match the existing socket or footprint. Ensure that the electrical parameters, such as propagation delay and drive current, meet the system's timing requirements.