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939113493547-T3N is listed in the Silicon Capacitors range at ChipApex. The manufacturer field lists Murata Electronics. Its product description is C-NEW. Review the specifications below when checking this part for your BOM.
The Murata 939113493547-T3N is a silicon RF capacitor utilizing thin film technology, designed for high-frequency applications up to 40 GHz. It features an ultra-broadband response and low equivalent series inductance (ESL). The component has a capacitance of 0.047 µF and a voltage rating of 3.8 V. It is housed in a compact SMD/SMT package with dimensions of 0.8 mm in length and 0.4 mm in height, suitable for high-temperature environments.
Verify the specific datasheet version for the 939113493547-T3N to confirm exact electrical tolerances and thermal ratings prior to integration. Ensure that the 3.8 V voltage rating aligns with the target circuit's operational requirements. Cross-reference the physical dimensions against the PCB footprint to guarantee mechanical compatibility during assembly.
Select this component when ultra-broadband performance and minimal ESL are critical for signal integrity at frequencies approaching 40 GHz. The thin film silicon technology offers advantages over traditional ceramic types in specific high-frequency regimes. Consider the low voltage rating of 3.8 V when designing power distribution networks or coupling stages within the RF chain.
This part belongs to Murata’s silicon RF capacitor family, which utilizes thin film deposition techniques rather than conventional dielectric materials. This approach allows for superior high-frequency behavior and lower parasitic inductance compared to standard MLCCs. The product line targets advanced wireless communication and radar systems requiring precise impedance matching and filtering.
No public confirmed substitute part numbers are available in the provided documentation. Engineers should evaluate other Murata silicon RF capacitors within the same series for potential alternatives, ensuring that frequency range, capacitance value, and package dimensions remain compatible with the existing design constraints.
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