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95290-305ALF is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Amphenol ICC (FCI). Its product description is CONN RCPT 10POS 0.1 GOLD SMD. Review the specifications below when checking this part for your BOM.
The Amphenol ICC (FCI) 95290-305ALF is a surface mount board-to-board receptacle from the Dubox series. It features 10 positions in a dual-row configuration with a 0.100 inch (2.54mm) pitch. The connector utilizes phosphor bronze contacts with gold plating for mating surfaces and tin plating for termination, housed in gray PCT insulation rated UL94 V-0. Designed for vertical mounting, it supports push-pull fastening and offers bottom or top insertion access.
Verify component authenticity through authorized channels to ensure compliance with RoHS3 standards. Confirm that the specific ordering suffix matches the required packaging format, such as tape and reel or cut tape, to align with manufacturing processes. Cross-reference datasheet specifications against current environmental regulations before finalizing procurement orders.
Evaluate the 0.100 inch pitch requirement against available PCB layout constraints to ensure adequate spacing. Consider the 8.71mm housing height when determining stack-up dimensions within the enclosure. Verify that the phosphor bronze contact material meets the necessary current carrying capacity and durability requirements for the target application environment.
This component belongs to the Dubox family of connectors, which are engineered for high-density interconnect solutions. The series is characterized by robust mechanical performance and versatile mounting options suitable for demanding environments. As a surface mount device, it integrates seamlessly into modern PCB assembly workflows requiring reliable board-to-board connections.
Consult official cross-reference tools for parametrically similar parts. Ensure substitute components match the 10-position count, 2.54mm pitch, and dual-row configuration. Verify compatibility with existing push-pull locking mechanisms and surface mount footprints before implementation.
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