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95687-408HLF is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Amphenol ICC (FCI). Its product description is CONN HEADER VERT 8POS 2.54MM. Review the specifications below when checking this part for your BOM.
The Amphenol ICC (FCI) 95687-408HLF is a board-to-board and mezzanine connector header. It features 8 positions with a 2.54 mm pitch. The component utilizes a double-row configuration for vertical mounting. Contact termination is achieved via through-hole soldering. The maximum current rating is 3 A per contact. Insulation resistance is specified at 5 GOhms. Operating temperature ranges from -55 C to +105 C.
Verify the specific ordering suffix to confirm pin count, row configuration, and termination style. Ensure compatibility with mating connectors regarding pitch and height. Check RoHS compliance status if required by project specifications. Confirm lead time availability as manufacturing schedules may vary. Validate that the selected variant matches the intended mechanical constraints of the assembly.
Select this component when a low-profile, double-row header is required for vertical board connections. Consider the 2.54 mm pitch for standard spacing requirements. Evaluate the 3 A current rating against the application's power needs. Verify that the through-hole termination method aligns with the PCB fabrication capabilities. Assess the operating temperature range to ensure suitability for the environmental conditions.
This part belongs to the Amphenol FCI rectangular connector family. It is designed for high-reliability interconnect solutions. The manufacturer provides various configurations within this series to accommodate different position counts and mounting styles. These connectors are widely used in datacom, telecom, and industrial sectors.
Direct substitutes must match the 2.54 mm pitch, 8-position count, and double-row vertical orientation. Verify that alternative headers share the same through-hole termination and current rating. Ensure mechanical dimensions are compatible with existing PCB footprints and mating components.
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