9DBV0941AKLF

Overview

The 9DBV0941AKLF is a 9-output, 1.8V PCIe fanout clock buffer from Renesas Electronics. It operates within a supply voltage range of 1.71V to 1.89V and supports frequencies up to 200MHz. The device features nine differential outputs with integrated terminations for direct connection to 100Ω transmission lines. It includes nine output enable pins for clock management and three selectable SMBus addresses. The component is housed in a 48-lead VFQFPN package (6.0 x 6.0 mm) and operates at temperatures between 0°C and 70°C.

Feature Summary

• Nine differential LP-HCSL outputs with integrated 100Ω terminations
• Supports PCIe Gen 1 through Gen 3 standards
• Three selectable SMBus addresses for multi-device configuration
• Low power consumption typical of 50mW

Applications

• PCI Express (PCIe) system clock distribution
• Server and storage backplane timing
• High-performance computing platforms

Procurement Notes

Verify the specific suffix 'AKLF' against the manufacturer's current datasheet to confirm pinout and electrical specifications. Check for moisture sensitivity level (MSL) requirements during handling. Confirm availability status as this family may have transitioned to newer revisions or alternative part numbers.

Selection Notes

Select this component when a high-channel-count fanout buffer is required for PCIe applications. Ensure the design accommodates the 1.8V core voltage and 3.3V tolerant SMBus interface. Verify that the 48-pin VFQFPN package fits the PCB layout constraints compared to smaller footprint alternatives like the 9DBV0541.

Part Context

This part belongs to the 9DBV05x1/07x1/09x1 family of PCIe clock buffers. It serves as a high-density solution for distributing reference clocks to multiple PCIe endpoints. The device eliminates external termination resistors, reducing board space and component count compared to standard HCSL buffers.

Replacement Considerations

Check for updated Renesas part numbers within the same family. Verify if the 9DBV0941AKLFT (tape and reel) is available as an alternative packaging option.