9FGL6251AQ301LTGI

Overview

The 9FGL6251AQ301LTGI is a clock generator and buffer from the Renesas 9FGL6251 series, designed for PCIe applications. It supports Common (CC) and Independent Reference (IR) architectures, featuring two differential LP-HCSL outputs with integrated 85-ohm terminations. The device accepts 25MHz or 33.33MHz reference inputs and includes SMBus-selectable spread spectrum capabilities. It operates on 2.5V or 3.3V supplies within a -40°C to 85°C temperature range.

Feature Summary

• Supports SRnS (IR), CC, and SRIS (IR) clocking architectures
• Two 100MHz Low-power HCSL (LP-HCSL) outputs with 85Ω impedance
• Integrated crystal option available (Q suffix)
• SMBus-selectable -0.25% Spread Spectrum Clocking (SSC)

Applications

• Single and dual-ported NVMe SSDs
• U.2 and M.2 form factor storage devices
• PCIe master/slave clock distribution

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current datasheet to confirm package type and configuration options. Confirm availability status directly with authorized distributors as supply levels fluctuate. Ensure compliance with RoHS directives and moisture sensitivity level requirements during handling and storage.

Selection Notes

Select this component for designs requiring intelligent clock buffering with automatic input detection. Choose the Q variant if an integrated crystal is preferred over an external oscillator. Verify that the 85Ω output impedance matches the load requirements of the downstream PCIe endpoints.

Part Context

This part belongs to the 9FGL6251 family of intelligent PCIe clock buffers. Variants such as 9FGL6251AQ201 and 9FGL6251AQ301 differ primarily in their pinout configurations and specific output arrangements while maintaining core functionality for NVMe and PCIe systems.

Replacement Considerations

Direct replacements include other members of the 9FGL6251 family, such as the 9FGL6251AQ201LTGI, provided the pinout compatibility is verified. Cross-model substitution requires checking for differences in output impedance and package dimensions.