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Product Detailed Parameters
- Description：FEMALE HEADER
- Series：A-BL127
- Mfr：Assmann WSW Components
- Package：Bulk
- Connector Type：Receptacle, Bottom Entry
- Contact Type：Female Socket
- Style：Board to Board
- Number of Positions：74
- Number of Positions Loaded：All
- Pitch - Mating：0.050" (1.27mm)
- Number of Rows：2
- Row Spacing - Mating：0.050" (1.27mm)
- Mounting Type：Surface Mount
- Termination：Solder
- Fastening Type：Push-Pull
- Contact Finish - Mating：Tin
- Contact Finish Thickness - Mating：-
- Insulation Color：Black
- Insulation Height：0.181" (4.60mm)
- Contact Length - Post：-
- Operating Temperature：-40°C ~ 105°C
- Material Flammability Rating：UL94 V-0
- Contact Finish - Post：-
- Mated Stacking Heights：-
- Ingress Protection：-
- Features：Pick and Place
- Current Rating (Amps)：1A per Contact
- Voltage Rating：-
Download product information
Overview
The A-BL127-DG-Z74MP1 is a dual-row surface mount female header manufactured by ASSMANN WSW Components. It features an 80-pin configuration with a 1.27 mm pitch, designed for board-to-board connections. The contacts are stamped and gold-plated to ensure reliable signal transmission. This component utilizes straight orientation and is intended for automated SMT assembly processes.
Feature Summary
- Dual-row surface mount construction for compact PCB integration
- Gold-plated stamped contacts for enhanced conductivity
- Straight orientation compatible with standard reflow soldering
Applications
- High-density board-to-board interconnects
- Industrial control system modules
- Telecommunications equipment interfaces
Procurement Notes
Verify the specific ordering suffix against official manufacturer documentation to confirm pin count and plating specifications. Ensure compatibility with surface mount assembly equipment. Cross-reference the part number with authorized distributors to confirm current availability status and compliance with relevant environmental standards.
Selection Notes
Select this component when high-density dual-row connectivity is required on space-constrained printed circuit boards. The 1.27 mm pitch allows for increased contact density compared to standard 2.54 mm headers. Verify that the gold plating meets the electrical requirements for the specific application signals.
Part Context
This part belongs to the ASSMANN WSW Components header family, specifically designed for surface mount technology applications. It represents a solution for modern electronics requiring robust, high-pin-count connections in a small footprint. The product line focuses on providing reliable interconnect solutions for demanding industrial and commercial environments.
Replacement Considerations
No public confirmed substitute part numbers are available in the provided data. Consult the manufacturer for direct equivalents or cross-reference based on identical mechanical and electrical parameters.
