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A-BL200DG74-022-GSR1 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is FEMALE HEADER, STAMPED PIN, 2.00. Review the specifications below when checking this part for your BOM.
The A-BL200DG74-022-GSR1 is a 74-position female header connector from the ASSMANN WSW Components A-BL200 series. It features a 2.00mm (0.079 inch) pin spacing and utilizes stamped pin technology for reliable electrical contact. The connector is designed for surface mount installation, facilitating automated pick-and-place assembly processes. Contacts are plated with gold to ensure corrosion resistance and low contact impedance. The housing material meets UL 94 V-0 flammability standards, providing safety in electronic assemblies.
Verify the specific ordering suffix against the manufacturer's current documentation to confirm exact pin count and termination style. Ensure compatibility with surface mount reflow profiles and check for RoHS compliance status prior to integration into production environments.
Select this component when surface mount technology is required for 74-position interconnects. The 2.00mm pitch offers a balance between density and manufacturability. Gold plating is essential for applications involving frequent mating cycles or harsh environmental conditions where oxidation resistance is critical for long-term reliability.
This part belongs to the A-BL200 series of female headers manufactured by ASSMANN WSW Components. The series specializes in stamped pin technology optimized for surface mount applications. These connectors are widely used in modern electronics manufacturing due to their compatibility with high-speed automated assembly processes and consistent performance characteristics.
Direct substitutes must match the 74-position count, 2.00mm pitch, surface mount orientation, and gold-plated stamped pin construction. Verify that alternative components maintain identical mechanical dimensions and thermal resistance ratings to ensure seamless replacement without redesigning the printed circuit board footprint.
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