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A-BL254-DG-Z54MP1 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is FEMALE HEADER. Review the specifications below when checking this part for your BOM.
The A-BL254-DG-Z54MP1 is a dual-row female header manufactured by ASSMANN WSW. It features a 2.54 mm pitch and supports up to 500V voltage with a 12A current rating. The connector utilizes gold-plated bronze contacts for reliable signal transmission. Designed for through-hole mounting, it offers a straight orientation suitable for PCB integration. Operating temperatures range from -40°C to 105°C, ensuring stability in various environments.
Verify the specific contact count and row configuration against project requirements before ordering. Confirm that the 2.54 mm pitch aligns with mating connector specifications. Ensure the through-hole mounting style matches the target PCB design capabilities. Check temperature ratings against operational environmental conditions to guarantee long-term reliability.
Select this component when a dual-row female header with a 2.54 mm pitch is required. Consider the 12A current capacity and 500V insulation rating for appropriate load handling. Evaluate the straight orientation and through-hole installation method against available board space and assembly processes. Compare operating temperature ranges with expected environmental extremes.
This part belongs to the A-BL254 series of connectors from ASSMANN WSW. The series focuses on standard pitch headers for general electronic applications. The model designation indicates specific physical and electrical characteristics within this product line. It serves as a standard interface solution for connecting cables or secondary boards.
Compatible substitutes must match the 2.54 mm pitch, dual-row female configuration, and through-hole mounting style. Verify equivalent current and voltage ratings to maintain safety margins. Ensure physical dimensions allow for direct replacement without modifying the host PCB layout.
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