A-SL127-EG-Z06MR1

Headers, Male Pins Overview

The A-SL127-EG-Z06MR1 is a surface-mount IC socket designed for DIP packages, manufactured by ASSMANN WSW Components. It features a 1.27 mm terminal pitch and supports 6 contacts with a 0.1-inch row spacing. The housing utilizes Polyphenylene Sulfide (PPS) material, ensuring high thermal stability and compliance with UL 94V-0 flammability standards. Contacts are constructed from brass with gold plating for reliable signal transmission, while termination finishes consist of tin over nickel barriers to facilitate soldering. Rated at 3 A current, the component offers an insulation resistance of 1 GΩ and withstands AC 500 V dielectric voltage for one minute, suitable for automated PCB assembly processes.

Headers, Male Pins Feature Summary

• Surface mount design compatible with automated pick-and-place equipment
• Gold-plated brass contacts ensure stable electrical connectivity
• Polyphenylene sulfide housing provides high heat resistance

Headers, Male Pins Applications

• Automated surface mount technology (SMT) production lines
• Prototyping and testing of DIP integrated circuits
• High-density electronic assemblies requiring rework capability

Headers, Male Pins Procurement Notes

Verify that the specific suffix Z06MR1 matches the required reel packaging configuration for your manufacturing line. Confirm that the gold contact finish aligns with your corrosion resistance requirements. Ensure the PPS housing temperature rating exceeds the peak soldering temperatures encountered during your assembly process. Cross-reference the pin count against the target DIP package dimensions to prevent mechanical misalignment.

Headers, Male Pins Selection Notes

Select this component when surface mounting is preferred over through-hole technology to reduce profile height. The 1.27 mm pitch accommodates standard DIP footprints while allowing for tighter board spacing. Consider the gold contact finish if long-term oxidation resistance is critical. Verify that the operating temperature range covers the environmental conditions of the final application.

Headers, Male Pins Part Context

This part belongs to the ASSMANN SL series of surface mount IC sockets. Unlike traditional through-hole variants, this model integrates directly onto the PCB surface. The series maintains compatibility with common DIP form factors while offering improved mechanical stability during wave soldering or reflow processes. It serves as a bridge between fixed socket applications and flexible prototyping needs in modern electronics manufacturing.

Headers, Male Pins Replacement Considerations

Direct substitutes within the same manufacturer family include models sharing the 1.27 mm pitch and identical contact counts. Verify that alternative surface mount sockets maintain the same PPS housing material and gold contact specifications to ensure equivalent thermal and electrical performance.