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A1460A-1PQ208C is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microsemi Corporation. Its product description is IC FPGA 167 I/O 208QFP. Review the specifications below when checking this part for your BOM.
The A1460A-1PQ208C is a Field Programmable Gate Array (FPGA) from the Microsemi ACT family, designed for high-density logic applications. It features 1232 Configurable Logic Blocks (CLBs) and supports up to 140 user I/O pins within a 208-pin Plastic Quad Flat Package (PQFP). The device operates on a single 5V supply voltage, ranging from 4.5V to 5.5V, and is rated for commercial temperature conditions between 0°C and 70°C. With a maximum clock frequency of 110 MHz, it provides deterministic timing suitable for complex digital systems.
Verify component authenticity through authorized Microchip Technology distributors or certified agents. Confirm the specific suffix 'C' denotes commercial temperature range and PQFP package variant. Request original manufacturer datasheets and test reports to validate performance specifications against application requirements before finalizing acquisition.
Select this model when designing systems requiring moderate logic density with strict 5V I/O compatibility. Ensure PCB layout accommodates the 208-PQFP footprint dimensions. Compare against higher-performance ACT families if frequencies exceeding 110 MHz are required, or consider lower-density variants for cost-sensitive applications with reduced pin counts.
This component belongs to the Microsemi ACT FPGA series, representing a generation of high-performance, low-power programmable logic devices. The ACT family was widely adopted for replacing fixed-function logic in telecommunications and computing infrastructure, offering reprogrammability advantages over traditional ASICs while maintaining competitive speed and power profiles.
Direct replacements may include other ACT family members such as the A1280A or A1440A, provided pinouts and logic capacities align. Verify that alternative packages maintain the same thermal and mechanical constraints for existing board designs without requiring redesign.
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