A2C01180200

A2C01180200

$18.67
  • Description:IC MCU 32BIT 416PBGA
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tray
  • Core Processor:-

SKU:dfc57cef113c Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MCU 32BIT 416PBGA
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tray
  • Core Processor:-
  • Core Size:-
  • Speed:-
  • Connectivity:-
  • Peripherals:-
  • Number of I/O:-
  • Program Memory Size:-
  • Program Memory Type:-
  • EEPROM Size:-
  • RAM Size:-
  • Voltage - Supply (Vcc/Vdd):-
  • Data Converters:-
  • Oscillator Type:-
  • Operating Temperature:-
  • Mounting Type:-
  • Supplier Device Package:-
  • Package / Case:-

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A2C01180200

Overview

The A2C01180200 is a 32-bit microcontroller unit (MCU) manufactured by Infineon Technologies. It belongs to the FM3 series, which is based on the Arm Cortex-M3 core architecture. The device is housed in a 416-ball Plastic Ball Grid Array (PBGA) package. As an automotive-grade component, it is designed for high-performance applications requiring robust processing capabilities within the semiconductor and system solutions portfolio.

Feature Summary

  • Integrates the Arm Cortex-M3 processor core for efficient code execution
  • Designed specifically for automotive electronic control applications
  • Utilizes a 416-ball PBGA package for high-density interconnects

Applications

  • Automotive engine control units
  • Body electronics management systems
  • Chassis control modules

Procurement Notes

Verify the specific revision level and packaging configuration when sourcing this component. Confirm that the supplier provides original manufacturer documentation to ensure authenticity. Check for RoHS compliance status as required by your assembly standards. Ensure the procurement channel is authorized to guarantee supply chain integrity for automotive-grade parts.

Selection Notes

Select this MCU when a high-performance 32-bit solution with an Arm Cortex-M3 core is required for automotive environments. The 416-ball PBGA package suits designs needing extensive I/O connectivity. Consider thermal management requirements associated with the BGA form factor during PCB layout. Validate software toolchain compatibility with the FM3 series before finalizing the design.

Part Context

This part is part of Infineon's FM3 family, targeting the automotive sector. It complements other power and sensor solutions offered by the company. The FM3 series is known for balancing performance and power efficiency in embedded control tasks. It serves as a central processing element in complex vehicle subsystems.

Replacement Considerations

Consult official Infineon documentation for qualified pin-to-pin or functional replacements. Verify that any substitute maintains the same automotive qualification standards and package dimensions. Cross-reference memory sizes and peripheral sets to ensure design compatibility.

A2C01180200A2C01180200
$18.67
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