A2F500M3G-1FGG484M

Soc System On Chip Overview

The A2F500M3G-1FGG484M is a SmartFusion customizable System-on-Chip (cSoC) manufactured by Microchip Technology. It integrates a hard ARM Cortex-M3 processor with flash-based FPGA fabric in a 484-pin Fine-Pitch Ball Grid Array (FPBGA) package. The device features up to 500,000 system gates and includes embedded nonvolatile memory (eNVM) ranging from 128 Kbytes to 512 Kbytes, alongside embedded SRAM blocks. Designed for industrial and commercial applications, it supports mixed-voltage I/O standards and offers instant-on capabilities due to its nonvolatile architecture.

Soc System On Chip Feature Summary

• Integrates a hard 100 MHz 32-bit ARM Cortex-M3 microcontroller subsystem with JTAG and SWD debug interfaces.
• Utilizes 130-nm flash-based CMOS process technology, enabling instant-on functionality without external boot memory.
• Provides up to 500,000 system gates and up to 144 kbits of true dual-port SRAM within the programmable fabric.
• Includes an on-chip 128-bit AES decryption engine for secure In-System Programming (ISP) via JTAG.

Soc System On Chip Applications

• Industrial automation controllers requiring deterministic logic and real-time processing.
• Automotive body electronics and gateway applications utilizing mixed-signal I/O capabilities.
• Secure communication infrastructure leveraging hardware-based encryption and ISP security features.
• Test and measurement equipment benefiting from instant-on reprogrammable logic.

Soc System On Chip Procurement Notes

Verify the specific eNVM capacity variant required, as the A2F500M3G family spans multiple memory sizes. Confirm RoHS compliance status, as historical data indicates variations across production batches and revisions. Ensure the design accounts for the 1.5V core voltage requirement and appropriate I/O bank voltages. Check for any active Product Change Notices (PCNs) regarding packaging or manufacturing site updates before finalizing procurement.

Soc System On Chip Selection Notes

Select this component when a single-chip solution combining a microcontroller and FPGA fabric is necessary to reduce board space and power consumption. Compare against the M2GL series if lower density or different power profiles are needed, or against the A2F500M3E/F variants if different pin counts or package types are preferred. Ensure the 484-ball package fits the thermal and mechanical constraints of the target enclosure.

Soc System On Chip Part Context

This part belongs to the SmartFusion cSoC family, which bridges the gap between traditional MCUs and FPGAs. It is derived from Microsemi's ProASIC3 flash FPGA heritage, retaining the nonvolatile advantage while adding a hardened ARM core. The 'M' suffix typically denotes a specific mass-production or moisture sensitivity level configuration within the broader A2F500M3G product line.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements within the same package are limited to other A2F500M3G variants with compatible memory densities. For functional equivalents in different packages, consider the A2F500M3E-FG256I or A2F500M3F-CSG288I, though these require significant schematic and layout redesigns due to differing pinouts and I/O counts.