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A3P060-1TQ144 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 91 I/O 144TQFP. Review the specifications below when checking this part for your BOM.
The A3P060-1TQ144 is a Field Programmable Gate Array belonging to the ProASIC3 Flash family, manufactured by Microchip Technology. It features 700 Logic Elements and operates at a maximum clock frequency of 250 MHz. The device utilizes a TQFP-144 surface-mount package with 91 I/O pins. It supports a supply voltage range from 1.425 V to 1.575 V, with a nominal voltage of 1.5 V. The component is rated for an industrial temperature range spanning from -40 °C to +85 °C.
Verify the specific suffix '1' indicates the -40°C to +85°C industrial temperature grade during procurement. Confirm the TQFP-144 package availability matches the required PCB footprint. Ensure the ordering part number aligns with current Microchip production status, as legacy FPGA families may have transitioned statuses or require specific lifecycle notifications before purchase.
Select this model when non-volatile configuration and immediate operation at power-up are critical design constraints. The 700 LE capacity suits simple logic replacement or small-scale prototyping tasks. Verify that the 91 available I/O pins meet interface requirements, as larger variants in the ProASIC3 family offer higher density but different pin counts.
This component is part of the ProASIC3 Flash family, which bridges the gap between ASICs and SRAM-based FPGAs by offering reprogrammability with non-volatile storage. Originally developed by Actel and acquired by Microsemi (now Microchip), this technology eliminates the need for external configuration PROMs, reducing system bill-of-materials and board space.
Direct replacements within the same family include the A3P060-1VQG100 for QFN packaging or the A3P060-2TQG144 for extended commercial temperature ranges. Cross-family migration to PolarFire or IGloo2 requires significant architectural redesign due to differences in logic structure and I/O capabilities.
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