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A3P060-2TQG144 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 91 I/O 144TQFP. Review the specifications below when checking this part for your BOM.
The A3P060-2TQG144 is a ProASIC3 FPGA manufactured by Microchip Technology, featuring 60,000 gates and 700 logic elements. It operates with a maximum frequency of 310 MHz and supports 91 I/O pins within a TQFP-144 package. The device functions at a supply voltage of 1.5 V, ranging from 1.425 V to 1.575 V. It includes zero embedded memory bits and is rated for an operating temperature range of 0°C to +70°C. The component exhibits moisture sensitivity and utilizes surface mount installation.
Verify current availability status directly with the manufacturer or authorized distributors, as this specific part number may be subject to limited supply conditions or discontinuation notices. Confirm RoHS compliance details and humidity sensitivity handling requirements prior to ordering. Ensure that the procurement channel provides valid traceability documentation consistent with Microchip Technology standards for programmable logic devices.
Select this model when a compact 144-pin solution with moderate logic density is required for space-constrained designs. The TQFP-144 package offers a balance between pin count and board area efficiency compared to larger BGA options. Consider the 310 MHz performance limit and 1.5 V operation when evaluating system power budgets and signal integrity constraints relative to higher-speed FPGA alternatives.
This component belongs to the ProASIC3 family, which bridges the gap between standard ASICs and SRAM-based FPGAs by offering non-volatile programmability. The A3P060 variant specifically targets applications needing lower gate counts than the A3P1000 series while maintaining robust security and low power profiles typical of Microsemi's flash FPGA portfolio.
Publicly confirmed substitute part numbers are not available in the provided source material. Evaluate the A3P060-VQG100 for alternative packaging needs or the A3P1000 series for increased logic capacity, ensuring interface compatibility and thermal performance alignment before substitution.
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