A3P1000-1FG256I

Field Programmable Gate Array Overview

The A3P1000-1FG256I is a ProASIC3 Flash Field Programmable Gate Array featuring 1,000,000 system gates and 11,000 logic elements. It utilizes a 1.5 V core voltage with an operating range of 1.425 V to 1.575 V. The device supports up to 700 Mbps data rates and includes up to 144 kbits of embedded dual-port SRAM. It offers between 97 and 177 user I/Os depending on the specific configuration variant within the package. The component operates within temperature ranges extending from -40°C to +100°C or +125°C for industrial and extended grades. It is housed in a 256-pin FBGA package.

Field Programmable Gate Array Feature Summary

• Flash-based non-volatile technology enabling live-at-power-up functionality without external configuration memory.
• Supports mixed-voltage I/O banks allowing operation at 1.5 V, 1.8 V, 2.5 V, and 3.3 V levels simultaneously.
• Includes configurable clocking blocks with integrated phase-shift and multiply/divide capabilities.
• Features hot-swappable and cold-sparing I/O support for high-reliability applications.

Field Programmable Gate Array Applications

• Industrial control systems requiring deterministic boot times.
• Telecommunications infrastructure utilizing LVDS signaling standards.
• Military and aerospace avionics demanding radiation tolerance and flash reliability.
• Test and measurement equipment requiring high-speed parallel interfaces.

Field Programmable Gate Array Procurement Notes

Verify the specific suffix codes against the manufacturer's official datasheet to confirm temperature grade and speed bin accuracy. Ensure compliance with export control regulations, as this component may require additional documentation for international shipment. Confirm moisture sensitivity level handling procedures prior to assembly to prevent package damage during reflow soldering processes.

Field Programmable Gate Array Selection Notes

Select this model when non-volatile configuration and immediate power-up operation are required. Compare gate density and I/O count against the broader A3P1000 family variants to match pinout requirements. Evaluate power consumption profiles relative to the 1.5 V core voltage specifications. Consider the 256-pin FBGA footprint constraints for PCB layout compatibility.

Field Programmable Gate Array Part Context

This component belongs to the Microchip ProASIC3 Flash FPGA family, which bridges the gap between ASIC performance and FPGA flexibility. The series is characterized by its flash-based architecture, eliminating the need for external configuration PROMs. It serves as a drop-in replacement for older EPROM-based PLDs while offering significantly higher logic capacity and lower power consumption.

Field Programmable Gate Array Replacement Considerations

Direct pin-compatible substitutes exist within the same ProASIC3 Flash family, such as the A3P060 or A3P250, provided logic resource requirements are met. Verify that the alternative part number maintains the same 256-pin FBGA package dimensions and thermal characteristics.