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A3P1000-1PQ208M is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 154 I/O 208QFP. Review the specifications below when checking this part for your BOM.
The A3P1000-1PQ208M is a military-grade Flash FPGA from the ProASIC3/EL family, manufactured by Microchip Technology. It features 1 million system gates and 24,576 configurable logic blocks (CLBs). The device operates with a core voltage range of 1.425 V to 1.575 V and supports mixed-voltage I/O banks at 1.5 V, 1.8 V, 2.5 V, and 3.3 V. It includes up to 144 kbit of true dual-port SRAM and 1 kbit of FlashROM user nonvolatile memory. The component utilizes a PQFP-208 package with a 0.50 mm pitch and is rated for an operating temperature range of -55°C to +125°C.
Verify the specific suffix 'M' confirms military grade status against the official datasheet. Confirm RoHS exemption status as military parts often differ from commercial standards. Check for obsolescence notices or last-time buy availability directly from Microchip. Ensure supply chain authenticity due to the critical nature of defense applications.
Select this part when non-volatile configuration and instant power-up are required in a military environment. Compare gate density and I/O count against the A3PE3000 series if higher performance is needed. Verify that the PQFP-208 package fits the thermal and mechanical constraints of the target PCB design.
This component belongs to the ProASIC3/EL Flash FPGA family, which bridges the gap between ASIC cost and FPGA flexibility. It succeeded earlier Actel Flash FPGAs after Microchip's acquisition. The 'M' suffix distinguishes it from commercial variants, adhering to stricter military screening and testing protocols defined in the manufacturer's quality assurance documentation.
Publicly confirmed substitutes include other military-grade ProASIC3/EL devices such as the M1A3P1000L-PQ208I. Designers should verify pin compatibility and electrical specifications before swapping components within the same package type.
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