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A3P1000-1PQG208M is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 154 I/O 208QFP. Review the specifications below when checking this part for your BOM.
The A3P1000-1PQG208M is a flash-based Field Programmable Gate Array (FPGA) from the ProASIC3 family, manufactured by Microchip Technology. It features 1,000,000 system gates and 24,576 Configurable Logic Blocks (CLBs). The device operates within a core voltage range of 1.425 V to 1.575 V and supports mixed-voltage I/O banks at 1.5 V, 1.8 V, 2.5 V, and 3.3 V. It utilizes a 208-pin Plastic Quad Flatpack (PQFP) package with a 0.5 mm pitch. The component supports an industrial temperature range of -40°C to +85°C and includes up to 144 Kbits of True Dual-Port SRAM.
Verify the specific suffix 'M' against official Microchip documentation to confirm if it denotes a military-grade temperature extension or specific reliability qualification, as standard datasheets typically list 'I' for industrial and 'E' for extended ranges. Confirm RoHS compliance status directly with the manufacturer, as older ProASIC3 variants may have different environmental declarations. Ensure the PQFP-208 package availability aligns with current production lifecycles.
Select this component when non-vatile configuration and low static power consumption are critical compared to SRAM-based FPGAs. Compare gate density and I/O flexibility against the A3P250 or A3PE1000 models if resource requirements differ. Verify that the 208-pin PQFP footprint fits the PCB layout constraints, considering the 0.5 mm pin pitch. Evaluate the integrated PLL capabilities against external clock generator requirements.
This part belongs to the ProASIC3 Flash FPGA family, which bridges the gap between ASICs and traditional SRAM-based FPGAs. The family offers radiation tolerance options and instant-on security. The A3P1000 represents the high-end capacity within the standard ProASIC3 lineup, providing significant logic resources in a compact form factor suitable for space-constrained applications.
Direct pin-compatible replacements within the same package include the A3P1000-1PQG208I for industrial temperature ranges. For lower density needs, the A3P600-1PQG208I offers similar I/O counts with reduced logic resources. Cross-family migration to Axcelerator devices requires schematic and code adaptation due to architectural differences.
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