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A3P1000-2FG256 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 177 I/O 256FBGA. Review the specifications below when checking this part for your BOM.
The A3P1000-2FG256 is a Field Programmable Gate Array from the ProASIC3 Flash family, manufactured by Microchip Technology. It features 24,576 Configurable Logic Blocks (CLBs) and approximately 1,000,000 system gates. The device supports a maximum operating frequency of 350 MHz and includes up to 144 Kbits of True Dual-Port SRAM. It utilizes a 256-pin FineLine BGA package with a 1 mm pitch. The core voltage range is specified between 1.425 V and 1.575 V. The component operates within an industrial temperature range of -40 °C to +100 °C.
Verify the specific suffix codes against official Microchip documentation to confirm temperature grade and package variations. Ensure compatibility with existing PCB footprints for the 256-pin FBGA form factor. Confirm RoHS compliance status for the specific manufacturing lot if required by regulatory standards.
Select this model when design requirements exceed the capacity of smaller ProASIC3 devices but do not necessitate the higher density of the ProASIC3E family. Consider the integrated flash technology for applications where board space for external configuration EEPROMs is limited or where immediate boot-up is critical.
This component belongs to the ProASIC3 Flash FPGA family, which bridges the gap between ASICs and SRAM-based FPGAs. It offers the reprogrammability of FPGAs with the non-volatility typically associated with ASICs. The A3P1000 variant represents a mid-to-high density option within this specific generation of low-power programmable logic solutions.
Direct pin-compatible alternatives within the same package include other members of the A3P1000 series with different speed grades or temperature ranges. Cross-family migration to ProASIC3E may require schematic adjustments due to architectural differences.
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