A3P1000-2FGG256I

Field Programmable Gate Array Overview

The A3P1000-2FGG256I is a ProASIC3 Flash Field Programmable Gate Array manufactured by Microchip Technology. It features 24,576 configurable logic blocks and approximately 1,000,000 system gates. The device supports a maximum clock frequency of 350 MHz and includes up to 144 kbits of true dual-port SRAM. It operates within a supply voltage range of 1.425 V to 1.575 V and supports data rates up to 700 Mbps. The component is housed in a 256-pin FBGA package with dimensions of 17 mm x 17 mm and a height of 1.8 mm. It functions reliably across an industrial temperature range from -40 °C to +100 °C.

Field Programmable Gate Array Feature Summary

• Non-volatile Flash-based architecture enabling instant-on functionality without external configuration memory.
• Supports mixed-voltage I/O standards including LVCMOS, LVTTL, LVDS, and PCI/PCI-X for flexible interfacing.
• Integrates six Clock Control Blocks (CCBs) with phase-shift capabilities and integrated PLLs.
• Includes IEEE 1149.1 JTAG boundary scan test support for manufacturing verification.

Field Programmable Gate Array Applications

• High-speed digital signal processing interfaces requiring low latency.
• Industrial control systems necessitating instant-on boot capability.
• Telecommunications equipment utilizing LVDS signaling standards.
• Test and measurement instrumentation requiring reconfigurable logic.

Field Programmable Gate Array Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +100°C). Confirm RoHS compliance status as historical batches may vary. Check for export control classifications such as ECCN 3A991D if applicable to your region. Ensure the 256-pin FBGA footprint matches your PCB design constraints. Validate that the 1.5V core voltage aligns with your power delivery network.

Field Programmable Gate Array Selection Notes

Select this model when high gate density is required alongside non-volatile storage to eliminate configuration flash chips. Compare against the A3P1000L variant if lower power consumption is prioritized over speed. Consider the M1A3P1000 series if an embedded ARM Cortex-M1 processor is needed for system integration. Verify I/O count requirements as the FGG256 package provides 177 usable I/Os.

Field Programmable Gate Array Part Context

This component belongs to the Microchip ProASIC3 Flash FPGA family, which bridges the gap between ASICs and traditional SRAM-based FPGAs. The A3P1000 represents the high-end capacity of the standard ProASIC3 line, offering significant logic resources. It is distinct from the ProASIC3E series, which adds transceivers, and the ProASIC3L series, which focuses on ultra-low power applications.

Field Programmable Gate Array Replacement Considerations

Direct pin-compatible alternatives within the same package include the A3P1000-1FGG256I for slower speed grades or the A3P1000-2FGG256M for military temperature ranges. For upgraded features, consider the A3PE1500 series, though pinouts may differ. Cross-family migration to PolarFire or IGLOO2 requires schematic and software redesign due to architectural differences.