A3P1000-2FGG484

Field Programmable Gate Array Overview

The A3P1000-2FGG484 is a ProASIC3 FPGA from Microchip Technology, housed in a 484-pin FBGA package. It features 11,000 logic elements and supports up to 300 I/Os. The device operates at a maximum frequency of 310 MHz with a core voltage range of 1.425 V to 1.575 V. It functions within an industrial temperature range of 0°C to +70°C. The component utilizes CMOS technology and includes moisture sensitivity classification for handling requirements.

Field Programmable Gate Array Feature Summary

• Non-volatile flash-based architecture enabling instant-on functionality without external configuration memory.
• High-density programmable logic fabric supporting complex digital design implementations.
• Integrated security features including bitstream encryption and authentication capabilities.

Field Programmable Gate Array Applications

• Industrial control systems requiring reliable non-volatile logic processing.
• Automotive electronics applications demanding robust performance under varying thermal conditions.
• Telecommunications infrastructure utilizing high-speed serial interface protocols.

Field Programmable Gate Array Procurement Notes

Verify the specific suffix designation against official datasheets to confirm temperature grade and package variations. Ensure compliance with RoHS directives and check for any product change notifications affecting pinout or electrical characteristics before finalizing procurement specifications.

Field Programmable Gate Array Selection Notes

Compare logic element counts and I/O availability against alternative ProASIC3 variants to ensure optimal resource utilization. Evaluate power consumption profiles relative to the 1.5 V operating voltage. Confirm that the FBGA-484 footprint aligns with existing PCB layout constraints and thermal management strategies.

Field Programmable Gate Array Part Context

This component belongs to the Microchip ProASIC3 family, which bridges the gap between ASICs and standard FPGAs by offering lower power consumption and smaller form factors. The series is designed for cost-sensitive applications requiring moderate logic density and high reliability in compact electronic assemblies.

Field Programmable Gate Array Replacement Considerations

Direct substitutes include other ProASIC3 models such as A3P1000-2FGG484I for extended temperature ranges. Cross-family migration to IGLOO2 devices may require significant design adaptation due to architectural differences in logic blocks and memory structures.