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A3P1000-2FGG484I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 300 I/O 484FBGA. Review the specifications below when checking this part for your BOM.
The A3P1000-2FGG484I is a ProASIC3 field-programmable gate array manufactured by Microchip Technology. It features 11,000 logic elements and operates with a maximum frequency of 310 MHz. The device utilizes a 1.5 V core voltage, ranging from 1.425 V to 1.575 V. It is housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package with 300 available I/Os. The industrial temperature range spans from -40°C to +100°C. This non-volatile FPGA supports high-speed serial interfaces up to 700 Mb/s.
Verify the specific suffix 'I' indicates the industrial temperature grade (-40°C to +100°C) as distinct from commercial variants. Confirm the package marking matches the FBGA-484 physical dimensions. Ensure the ordering part number aligns with the required speed grade '-2'. Cross-reference the manufacturer's latest datasheet for any product change notifications affecting pin compatibility or electrical characteristics.
Select this component when non-volatile storage and low power consumption are critical compared to SRAM-based FPGAs. The 11K LE count suits moderate complexity designs. Verify that the 1.5 V core voltage is compatible with the system power budget. Consider the 484-pin package size constraints during PCB layout planning. Evaluate if the integrated ARM processor meets computational needs before choosing higher-density alternatives.
This device belongs to the Microchip ProASIC3 family, designed for cost-sensitive, low-power applications. It bridges the gap between ASICs and complex FPGAs. The A3P1000 variant offers a balance of logic density and I/O flexibility. It serves industries needing reliable, instant-on programmable logic without the overhead of configuration controllers.
The M7A3P1000-2FG484I is a verified substitute within the same package and logic density, featuring an integrated ARM processor. Direct pin-to-pin replacements require matching the FBGA-484 footprint and electrical specifications. Higher-density ProASIC3XL devices may require schematic and layout modifications.
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