A3P1000-FGG256

Field Programmable Gate Array Overview

The A3P1000-FGG256 is a Field Programmable Gate Array from the ProASIC3 Flash family, manufactured by Microchip Technology. It features 24,576 Configurable Logic Blocks (CLBs) and approximately 1,000,000 system gates. The device supports up to 144 kbits of True Dual-Port SRAM and offers up to 177 user I/Os in its 256-pin FineLine BGA package. It operates with a core voltage range of 1.425 V to 1.575 V and supports mixed-voltage I/O standards including LVTTL, LVCMOS, and PCI. The component utilizes non-volatile flash technology for instant power-up configuration.

Field Programmable Gate Array Feature Summary

• Non-volatile flash-based architecture enabling live-at-power-up operation without external configuration memory
• Support for mixed-voltage I/O banks allowing compatibility with 1.5 V, 1.8 V, 2.5 V, and 3.3 V signaling standards
• Integrated triple clock controller blocks with phase-shift capabilities for advanced timing management
• In-system programming capability via standard JTAG interface for secure design updates

Field Programmable Gate Array Applications

• Industrial automation control systems requiring deterministic logic processing
• Telecommunications infrastructure signal processing and protocol conversion
• Test and measurement equipment digital front-ends
• Automotive electronics gateways and display controllers

Field Programmable Gate Array Procurement Notes

Verify the specific suffix 'FGG256' corresponds to the 256-pin FineLine BGA package with 1 mm pitch. Confirm the temperature grade matches application requirements, as suffixes often indicate industrial or extended ranges. Ensure RoHS compliance status aligns with current manufacturing revisions. Cross-reference the manufacturer part number against official Microchip documentation to confirm availability and lifecycle status before procurement.

Field Programmable Gate Array Selection Notes

Select this component when a high-density FPGA with non-volatile configuration is required to reduce bill-of-materials count. The ProASIC3 Flash architecture eliminates the need for external configuration PROMs. Evaluate pin-count constraints carefully, as the 256-pin package limits available I/O resources compared to larger packages in the same family. Consider thermal performance under maximum load conditions given the 1.5 V core supply.

Field Programmable Gate Array Part Context

This part belongs to the Microchip ProASIC3 Flash family, which bridges the gap between ASICs and traditional volatile FPGAs. The A3P1000 variant represents a mid-to-high density option within the series, offering significant logic capacity in a compact footprint. The family is characterized by its radiation tolerance options and instant-on capability, distinguishing it from SRAM-based competitors.

Field Programmable Gate Array Replacement Considerations

Direct pin-compatible replacements exist within the ProASIC3 family, such as the A3P060 or A3P250, though logic capacity differs significantly. Verify that any substitute maintains the required I/O voltage levels and package dimensions. Check for obsolescence notices regarding older Actel-branded parts if migrating from legacy designs.