Field Programmable Gate Array A3P1000L-FGG256I product image

A3P1000L-FGG256I

  • Description:IC FPGA 177 I/O 256FBGA
  • Series:ProASIC3L

SKU:1e782cfa505e Category: Brand:

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A3P1000L-FGG256I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 177 I/O 256FBGA. Review the specifications below when checking this part for your BOM.

Field Programmable Gate Array specifications for A3P1000L-FGG256I

  • Description:IC FPGA 177 I/O 256FBGA
  • Series:ProASIC3L
  • Mfr:Microchip Technology
  • Package:Tray
  • Number of LABs/CLBs:-
  • Total RAM Bits:147456
  • Number of I/O:177
  • Voltage - Supply:1.14V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:256-LBGA
  • Supplier Device Package:256-FPBGA (17x17)
  • Number of Gates:1000000

Field Programmable Gate Array datasheet and documents for A3P1000L-FGG256I

A3P1000L-FGG256I

Field Programmable Gate Array Overview

The A3P1000L-FGG256I is a ProASIC3 Flash Field-Programmable Gate Array manufactured by Microchip Technology. It features 1,000,000 system gates and 11,000 logic elements within a 256-pin FineLine BGA package. The device supports mixed-voltage I/O operation at 1.5 V, 1.8 V, 2.5 V, and 3.3 V levels. It includes up to 144 kbits of embedded True Dual-Port SRAM and supports data rates up to 700 Mbps. The component operates within a commercial temperature range of 0°C to +85°C with a supply voltage tolerance between 1.425 V and 1.575 V for the core.

Field Programmable Gate Array Feature Summary

  • Non-volatile flash-based architecture enabling instant-on functionality without external configuration memory.
  • Supports mixed-voltage I/O banks allowing direct interfacing with various standard logic families.
  • Integrated True Dual-Port SRAM blocks for high-performance data buffering and processing.

Field Programmable Gate Array Applications

  • Industrial control systems requiring non-volatile programmability.
  • Telecommunications infrastructure equipment.
  • Automotive electronic modules.
  • Test and measurement instrumentation.

Field Programmable Gate Array Procurement Notes

Verify export compliance requirements as this product may require additional documentation for shipment from the United States. Confirm RoHS status and moisture sensitivity level prior to assembly planning. Ensure the specific suffix matches the required temperature grade and package variant for your design constraints.

Field Programmable Gate Array Selection Notes

Select this model when instant-on capability and low static power consumption are critical compared to SRAM-based FPGAs. The L-series designation indicates a lower power variant suitable for cost-sensitive applications. Verify that the 256-pin FBGA footprint aligns with your PCB layout capabilities and that the 11k LE density meets your logic resource requirements.

Field Programmable Gate Array Part Context

This component belongs to the Microchip ProASIC3 Flash family, which bridges the gap between ASICs and traditional SRAM FPGAs. The A3P1000L offers a balance of high gate count and low power consumption. It is designed for applications where system boot time and security against bitstream theft are important factors.

Field Programmable Gate Array Replacement Considerations

Direct pin-compatible replacements within the same family include other A3P1000 variants with different speed grades or package options. Cross-family migration to PolarFire or IGLOO2 requires schematic and code adaptation due to architectural differences.

A3P1000L-FGG256IA3P1000L-FGG256I

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