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A3P125-PQG208 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 133 I/O 208QFP. Review the specifications below when checking this part for your BOM.
The A3P125-PQG208 is a ProASIC3 Field Programmable Gate Array manufactured by Microchip Technology. It features 125,000 logic elements and supports up to 177 I/Os within a 208-pin PQFP package. The device operates on a single 1.5V supply voltage with a range of 1.425V to 1.575V. It includes 36,864 bits of embedded RAM for data storage and processing tasks. The component is designed for surface mount installation and functions reliably across an industrial temperature range from -40°C to +85°C.
Verify the specific suffix designation to confirm the exact package type and temperature grade before ordering. Ensure compatibility with existing PCB footprints for the 208-pin PQFP form factor. Confirm that the selected variant meets all required regulatory standards for the intended deployment environment. Cross-reference official documentation to validate pin assignments and electrical characteristics.
Select this model when a balance of moderate logic density and extensive I/O connectivity is required in a standard QFP package. Consider alternative packages if board space constraints favor ball grid array configurations. Evaluate power budget requirements against the 1.5V core voltage specifications. Verify that the 125K gate count adequately covers the design complexity without excessive resource utilization.
This component belongs to the ProASIC3 family, which bridges the gap between complex FPGAs and simple PLDs. It offers non-volatile reprogrammability suitable for applications where system boot time and configuration reliability are critical. The family provides a cost-effective solution for mid-range logic designs requiring significant I/O flexibility.
Direct replacements within the same series include the A3P125-FG144 for smaller footprint needs or the A3P250 for increased logic capacity. Ensure pin-to-pin compatibility when substituting models with different package types. Verify that any alternative part maintains the same voltage and thermal specifications for seamless integration.
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