A3P250-1FG256

Field Programmable Gate Array Overview

The A3P250-1FG256 is a ProASIC3 Flash Field Programmable Gate Array manufactured by Microchip Technology. It features 250,000 system gates and 3,000 logic elements within a 256-pin FineLine BGA package. The device operates on a single 1.5V supply voltage with a range of 1.425V to 1.575V. It includes 36 kbit of embedded SRAM and supports up to 157 user I/Os. The component functions reliably across an industrial temperature range from 0°C to +85°C.

Field Programmable Gate Array Feature Summary

• Flash-based non-volatile architecture enabling instant power-up operation without external configuration memory
• Support for mixed-voltage I/O standards including LVCMOS, LVTTL, LVDS, and PCI/PCI-X interfaces
• Integrated Clock Conditioning Circuits (CCC) with Phase-Locked Loops for advanced clock management

Field Programmable Gate Array Applications

• Industrial automation control systems requiring deterministic boot times
• Telecommunications infrastructure equipment utilizing high-speed serial interfaces
• Military and aerospace avionics applications demanding radiation-tolerant flash technology

Field Programmable Gate Array Procurement Notes

Verify the specific suffix codes against official Microchip documentation to confirm exact package dimensions and thermal characteristics. Ensure compliance with export regulations regarding encryption or military specifications before procurement. Confirm moisture sensitivity levels and reflow soldering profiles to prevent damage during assembly processes.

Field Programmable Gate Array Selection Notes

Select this model when a non-volatile FPGA solution is required to eliminate external configuration flash devices. Compare gate density and I/O counts against higher-capacity ProASIC3 variants if additional logic resources are anticipated. Verify that the 256-pin FBGA footprint aligns with existing PCB layout constraints and thermal dissipation requirements.

Field Programmable Gate Array Part Context

This component belongs to the Microchip ProASIC3 Flash family, which bridges the gap between ASIC performance and FPGA flexibility. The series utilizes a 130nm CMOS process to deliver high-density logic in compact packages. It serves as a drop-in replacement for older SRAM-based FPGAs where power-down data retention is critical.

Field Programmable Gate Array Replacement Considerations

Direct pin-compatible alternatives within the ProASIC3 family include the A3P060, A3P125, and A3P250 variants. Higher capacity options such as the A3P500 or A3P1000 may require schematic modifications due to increased I/O availability.