A3P250-1FGG256I

Field Programmable Gate Array Overview

The A3P250-1FGG256I is a Flash-based Field Programmable Gate Array from the Microchip ProASIC3 family. It provides 250,000 system gates and 3,000 logic elements within a 256-pin FineLine BGA package. The device features 36 kbit of embedded true dual-port SRAM and supports up to 157 user I/Os. It operates on a single 1.5 V supply with a voltage range of 1.425 V to 1.575 V. The component supports a maximum operating frequency of 350 MHz and functions within an industrial temperature range of -40°C to +100°C.

Field Programmable Gate Array Feature Summary

• Flash-based non-volatile architecture enabling live-at-power-up operation without external configuration memory
• Support for mixed-voltage I/O standards including LVDS, LVTTL, and LVCMOS across multiple banks
• Integrated clock conditioning circuitry with phase-locked loops for signal integrity management
• In-system programming capability allowing design updates via standard serial interfaces

Field Programmable Gate Array Applications

• Industrial automation control systems requiring deterministic boot times
• Telecommunications infrastructure equipment utilizing high-speed differential signaling
• Military and aerospace avionics applications demanding radiation-tolerant flash technology
• Test and measurement instruments requiring reconfigurable logic interfaces

Field Programmable Gate Array Procurement Notes

Verify the specific suffix 'I' confirms the extended industrial temperature range of -40°C to +100°C against the official datasheet. Confirm the '-1' speed grade matches the required timing constraints for your design. Ensure the FG256 package dimensions align with your PCB footprint requirements before finalizing orders.

Field Programmable Gate Array Selection Notes

Select this model when non-volatile configuration is required to eliminate external PROM components. The 250K gate count suits moderate complexity designs needing immediate power-on readiness. Consider the 157 I/O limit for interface density. Evaluate the 350 MHz performance against higher-end ProASIC3XL or Fusion families if greater throughput is necessary.

Field Programmable Gate Array Part Context

This component belongs to the ProASIC3 Flash FPGA family, which utilizes 130-nm CMOS technology. It serves as a mid-range solution in the portfolio, bridging lower-density ProASIC3E devices and higher-capacity ProASIC3XL parts. The family is characterized by its robust security features and resistance to single-event upsets common in harsh environments.

Field Programmable Gate Array Replacement Considerations

Direct pin-compatible replacements within the same package include the A3P250-VQG100I for smaller form factors or the A3P060 for reduced logic needs. For increased capacity, the A3P400 or A3P1000 series offer more gates but may require schematic adjustments due to different I/O counts and pin mappings.