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A3P250-2FGG256 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 157 I/O 256FBGA. Review the specifications below when checking this part for your BOM.
The A3P250-2FGG256 is a Field Programmable Gate Array belonging to the ProASIC3 Flash family, manufactured by Microchip Technology. It features 3000 Logic Elements and 250,000 system gates within a 256-pin FineLine BGA package measuring 17 x 17 mm with a 1.0 mm pitch. The device operates on a core voltage range of 1.425 V to 1.575 V and supports up to 157 user I/Os. It includes 36 kbit of embedded memory and achieves a maximum operating frequency of 350 MHz across an industrial temperature range of -40°C to +85°C.
Verify the specific suffix '2' indicates the industrial temperature grade (-40°C to +85°C) rather than commercial variants. Confirm the FBGA-256 package dimensions match the target PCB footprint. Ensure design tools support the legacy Actel/Microchip ProASIC3 flow for bitstream generation.
Select this model when non-volatile configuration and low standby power are critical compared to SRAM-based FPGAs. Compare against the A3P030 or A3P1000 if gate counts differ from the required 3000 LEs. Verify that the 157 available I/O pins satisfy the interface requirements for the specific application.
This component is part of the ProASIC3 Flash family, which bridges the gap between ASICs and standard SRAM FPGAs. Originally developed by Actel before its acquisition by Microchip Technology, the series is characterized by its instant-on capability and resistance to single-event upsets, making it suitable for secure and reliable embedded applications.
Direct pin-compatible alternatives within the same family include the A3P250-VQG100I in a QFP package or other A3P250 variants with different speed grades. Cross-family migration to Microchip PolarFire or IGLOO2 requires schematic and firmware redesign due to architectural differences.
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