Field Programmable Gate Array A3P250-2FGG256I product image

A3P250-2FGG256I

  • Description:IC FPGA 157 I/O 256FBGA
  • Series:ProASIC3

SKU:483c5d5b81aa Category: Brand:

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A3P250-2FGG256I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 157 I/O 256FBGA. Review the specifications below when checking this part for your BOM.

Field Programmable Gate Array specifications for A3P250-2FGG256I

  • Description:IC FPGA 157 I/O 256FBGA
  • Series:ProASIC3
  • Mfr:Microchip Technology
  • Package:Tray
  • Total RAM Bits:36864
  • Number of I/O:157
  • Voltage - Supply:1.425V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:256-LBGA
  • Supplier Device Package:256-FPBGA (17x17)
  • Number of Gates:250000
  • Grade:-
  • Qualification:-

Field Programmable Gate Array datasheet and documents for A3P250-2FGG256I

A3P250-2FGG256I

Field Programmable Gate Array Overview

The A3P250-2FGG256I is a Field Programmable Gate Array from the ProASIC3 Flash family, manufactured by Microchip Technology. It features 3000 logic elements and 250,000 system gates. The device includes 36 kbit of embedded memory and supports up to 157 I/Os. It operates within a voltage range of 1.425 V to 1.575 V and functions at temperatures between -40°C and +85°C. The unit is housed in an FBGA-256 package with a maximum operating frequency of 350 MHz.

Field Programmable Gate Array Feature Summary

  • Flash-based CMOS technology enabling live-at-power-up configuration without external memory
  • Bank-selectable I/O voltages supporting multiple standards including LVCMOS and LVDS
  • Integrated Clock Control Blocks (CCB) with Phase-Locked Loop (PLL) capabilities

Field Programmable Gate Array Applications

  • Industrial control systems requiring non-volatile reprogrammability
  • Telecommunications interface prototyping
  • Automotive electronics applications

Field Programmable Gate Array Procurement Notes

Verify the specific suffix '2' indicates the speed grade during procurement. Confirm RoHS compliance status as documentation may vary. Ensure handling procedures account for moisture sensitivity levels specified in the datasheet. Validate that the FBGA-256 package dimensions match the target PCB footprint requirements before finalizing orders.

Field Programmable Gate Array Selection Notes

Select this component when non-volatile flash configuration is required to eliminate external boot memory. Compare against the standard A3P250-FGG256I if higher speed performance is not critical. Consider the 2FGG256 designation for specific timing constraints. Evaluate power consumption profiles against other ProASIC3 variants for thermal management needs.

Field Programmable Gate Array Part Context

This part belongs to the ProASIC3 Flash family, which utilizes high-capacity reprogrammable flash technology. It serves as a mid-range solution within Microchip's FPGA portfolio, bridging the gap between low-density ASIC replacements and complex high-performance devices. The family emphasizes low power and instant-on functionality.

Field Programmable Gate Array Replacement Considerations

Direct pin-compatible substitutes exist within the same ProASIC3 Flash family, such as the A3P250-VQG100I for different package requirements. Verify functional equivalence regarding logic density and I/O counts when considering alternative packages.

A3P250-2FGG256IA3P250-2FGG256I

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