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A3P250-2VQ100 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 68 I/O 100VQFP. Review the specifications below when checking this part for your BOM.
The A3P250-2VQ100 is a ProASIC3 Flash Field Programmable Gate Array manufactured by Microchip Technology. It features 250,000 system gates and supports up to 68 user I/Os within a VQFP-100 package. The device operates on a 1.5 V core supply voltage with a range of 1.425 V to 1.575 V. It achieves a maximum operating frequency of 310 MHz and functions within a commercial temperature range of 0°C to +70°C. This non-volatile FPGA utilizes flash-based CMOS technology for instant-on capabilities.
Verify the specific suffix '2VQ100' against official Microchip documentation to confirm the speed grade, temperature range, and package type match project requirements. Ensure compliance with RoHS directives if applicable to the target market. Confirm availability through authorized distributors as lead times may vary based on production schedules.
Select this component when instant-on operation is critical and configuration memory is undesirable. Compare gate density and I/O count against larger ProASIC3 variants like the A3P500 or smaller ones like the A3P125. Verify that the VQFP-100 package fits the PCB footprint constraints and thermal requirements of the design.
This part belongs to the Microchip ProASIC3 Flash family, which bridges the gap between ASICs and SRAM-based FPGAs. Unlike volatile counterparts, it retains data without power. The A3P250 represents a mid-range density option within the series, offering significant logic resources in a compact form factor suitable for cost-sensitive applications.
Direct pin-compatible replacements within the same package include other members of the ProASIC3 Flash family such as the A3P060, A3P125, or A3P500, provided the logic resource requirements are met. Cross-family migration to SmartFusion or IGLOO requires schematic redesign due to architectural differences.
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