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A3P250-FGG256T is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 157 I/O 256FBGA. Review the specifications below when checking this part for your BOM.
The A3P250-FGG256T is a Field Programmable Gate Array from the ProASIC3 Flash family, manufactured by Microchip Technology. It features 250,000 system gates and 3,000 logic elements within a 256-pin FineLine BGA package measuring 17x17 mm. The device includes 36 kbit of embedded SRAM and supports up to 157 user I/Os. It operates at a maximum frequency of 350 MHz with a core voltage range of 1.425 V to 1.575 V. The component utilizes reprogrammable flash technology for live-at-power-up functionality and retains programmed designs when powered off.
Verify the specific suffix 'T' against official Microchip documentation to confirm tape-and-reel packaging status, as standard listings may indicate tray packaging. Ensure the order matches the required industrial temperature grade if applicable. Confirm RoHS compliance status directly with the manufacturer or authorized distributors prior to procurement.
Select this model for designs requiring high-density logic in a compact 256-pin footprint. The ProASIC3 architecture offers lower power consumption compared to equivalent SRAM-based FPGAs. Consider the available I/O count and embedded memory size relative to design complexity. Verify pin compatibility with other devices in the ProASIC3 family for potential future scalability.
This component belongs to the ProASIC3 Flash FPGA family, which bridges the gap between ASICs and traditional FPGAs. It provides the flexibility of programmable logic with the non-vatility and security of flash technology. The family supports optional Soft ARM processor integration for complex embedded applications.
Pin-compatible alternatives within the ProASIC3 family include the A3P060, A3P120, A3P250, A3P400, A3P600, and A3P1000 series. These variants share the same package options but offer varying gate counts and resource capacities. Verify functional requirements before substituting with higher or lower density parts.
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