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A3P250-VQG100 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 68 I/O 100VQFP. Review the specifications below when checking this part for your BOM.
The A3P250-VQG100 is a ProASIC3 Flash Field Programmable Gate Array manufactured by Microchip Technology. It features 250,000 system gates and 3,000 logic elements within a 100-pin VQFP package. The device includes 36 kbit of embedded true dual-port SRAM and supports up to 157 user I/Os. Operating at a maximum frequency of 350 MHz, it utilizes a 1.5V core supply voltage ranging from 1.425V to 1.575V. Designed for commercial temperatures between 0°C and +85°C, this non-volatile FPGA offers high density with low power consumption in a compact surface-mount form factor.
Verify the specific suffix VQG100 against official Microchip documentation to confirm the 100-pin VQFP package dimensions and pinout. Ensure the temperature grade matches the commercial range specification. Cross-reference the manufacturer part number with authorized distributors to avoid counterfeit components. Confirm RoHS compliance status through current datasheet revisions before finalizing procurement orders.
Select this component when a non-volatile FPGA solution is required to reduce bill-of-materials complexity by removing external configuration chips. Compare gate counts and I/O availability against alternative ProASIC3 family members like the A3P060 or A3P125. Evaluate power consumption requirements against the 1.5V core voltage specifications. Consider package constraints if board space is limited, as the VQFP footprint differs significantly from BGA options.
This device belongs to the ProASIC3 Flash family, which bridges the gap between traditional ASICs and SRAM-based FPGAs. The family provides instant-on capability due to its non-volatile nature. The A3P250 variant represents a mid-range density option within the series, offering substantial logic resources while maintaining relatively low static power dissipation compared to larger counterparts.
Direct pin-compatible replacements within the same package include other ProASIC3 devices with equal or lower gate counts, such as the A3P125. Verify functional equivalence regarding I/O bank configurations and memory sizes when substituting. Higher density parts may require software reconfiguration but often maintain physical compatibility.
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