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A3P250L-1FGG256 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microsemi Corporation. Its product description is IC FPGA 157 I/O 256FBGA. Review the specifications below when checking this part for your BOM.
The A3P250L-1FGG256 is a ProASIC3L Field Programmable Gate Array manufactured by Microsemi Corporation. It features 250,000 system gates and 97 user I/Os within a 256-pin FBGA package. The device includes 36,864 bits of embedded SRAM. It operates on a core voltage range of 1.14 V to 1.575 V and supports an operating temperature range of -40°C to +100°C. The maximum system performance frequency is 350 MHz.
Verify the specific suffix '1' indicates the industrial temperature grade (-40°C to +100°C) against official datasheets. Confirm RoHS compliance status as historical records vary. Ensure ECAD models match the 256-FPBGA physical dimensions. Check for obsolescence notices from Microchip Technology prior to finalizing procurement plans.
Select this component when instant-on boot times are critical and external configuration flash is undesirable. Compare gate density and I/O counts against standard A3P250 variants if lower power is not required. Verify that the 256-pin FBGA footprint fits the target PCB layout constraints. Ensure design tools support the ProASIC3L family architecture.
This part belongs to the ProASIC3L series, which offers lower power consumption compared to the standard ProASIC3 family. It shares pin compatibility with other devices in the A3P250 family, facilitating design upgrades. The manufacturer transitioned from Actel to Microsemi and subsequently to Microchip Technology.
Direct pin-compatible replacements within the same package include other A3P250 family members such as A3P250 or A3P250V, provided power and speed grades align. Cross-family migration requires schematic and layout redesign due to architectural differences.
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