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A3P250L-FGG144 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microsemi Corporation. Its product description is IC FPGA 97 I/O 144FBGA. Review the specifications below when checking this part for your BOM.
The A3P250L-FGG144 is a ProASIC3L Field Programmable Gate Array manufactured by Microsemi Corporation. It features 250,000 system gates and 6,144 configurable logic blocks (CLBs). The device includes 36,864 bits of embedded SRAM and supports up to 97 user I/Os. It operates within a supply voltage range of 1.14V to 1.575V and functions at temperatures between 0°C and 85°C TJ. The component utilizes a 144-pin LBGA package with dimensions of 13x13 mm.
Verify the specific suffix FGG144 corresponds to the 144-pin LBGA package variant. Confirm the operating temperature grade matches industrial requirements. Check for RoHS compliance status as manufacturing updates may affect environmental certifications. Ensure the source document explicitly identifies this part number under the ProASIC3L series to avoid confusion with standard ProASIC3 devices.
Select this model when non-volatile flash technology is required to eliminate boot-up delays associated with volatile SRAM FPGAs. The ProASIC3L series offers lower power consumption compared to standard ProASIC3 devices. Verify that the 250,000 gate count and 36,864-bit RAM capacity meet the design complexity requirements. Ensure the 144-pin LBGA footprint fits the target PCB layout constraints.
This component belongs to the Microsemi ProASIC3L family, which is designed for low-power, high-reliability applications. The ProASIC3L series distinguishes itself from the standard ProASIC3 line through optimized power characteristics while maintaining similar performance metrics. It serves as a bridge between complex ASICs and larger FPGA families, offering a cost-effective solution for mid-range logic density needs in harsh environments.
Publicly confirmed substitute part numbers are not available in the provided documentation. Designers should consult Microchip official resources for current lifecycle status and potential obsolescence notices before finalizing designs.
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