A3P250L-FGG144I

Field Programmable Gate Array Overview

The A3P250L-FGG144I is a ProASIC3L field-programmable gate array (FPGA) manufactured by Microsemi Corporation. It features 250,000 system gates and 768 configurable logic blocks (CLBs). The device integrates 36,864 bits of embedded SRAM and provides 97 user I/Os. It operates within a supply voltage range of 1.14V to 1.575V and supports an industrial junction temperature range of -40°C to 100°C. The component is housed in a 144-lead low-profile ball grid array (LBGA) package with dimensions of 13x13 mm.

Field Programmable Gate Array Feature Summary

• Utilizes reprogrammable flash technology for non-volatile configuration that retains data when powered off.
• Supports live at power-up (LAPU) functionality for immediate operation upon power application.
• Enables mixed-voltage I/O operation across multiple banks with support for various single-ended and differential standards.

Field Programmable Gate Array Applications

• Industrial control systems requiring robust non-volatile programmability
• Telecommunications infrastructure utilizing high-speed serial interfaces
• Automotive electronics operating within extended temperature ranges

Field Programmable Gate Array Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to 100°C TJ) against the official datasheet. Confirm the package designation FGG144 corresponds to the 144-LBGA form factor. Check current availability status as this series may be subject to discontinuation notices from the manufacturer.

Field Programmable Gate Array Selection Notes

Select this model when a mid-range FPGA capacity of 250k gates is required alongside integrated flash memory for instant boot applications. Ensure the design accommodates the 1.14V to 1.575V core voltage requirements. Verify that the 144-pin LBGA footprint fits the target PCB layout constraints.

Field Programmable Gate Array Part Context

This component belongs to the ProASIC3L family, which is characterized by its low-power flash-based architecture. It serves as a bridge between ASIC performance and FPGA flexibility, offering higher density than the smaller ProASIC3 devices while maintaining lower power consumption compared to SRAM-based FPGAs.

Field Programmable Gate Array Replacement Considerations

Direct substitutes include other variants within the A3P250L family with different pin counts or speed grades, such as A3P250L-VFG400 or A3P250L-FFG484, provided pin compatibility and I/O requirements are met. Cross-family migration to newer Microsemi SmartFusion or IGLOO2 devices may require significant redesign.