A3P250L-FGG256

Field Programmable Gate Array Overview

The A3P250L-FGG256 is a Field Programmable Gate Array (FPGA) belonging to the ProASIC3L Flash family, manufactured by Microsemi Corporation. It features 250,000 system gates and 36,864 bits of embedded SRAM. The device utilizes a 130-nm, 7-layer metal flash-based CMOS process and supports Live at Power-Up (LAPU) functionality for instant-on applications. It operates with a core voltage range of 1.14V to 1.575V and is housed in a 256-pin Low-Profile Ball Grid Array (LBGA) package measuring 17x17 mm with a 1.0 mm pitch. The component supports mixed-voltage I/O standards including LVCMOS 3.3V/2.5V/1.8V/1.5V and differential standards such as LVDS.

Field Programmable Gate Array Feature Summary

• Flash-based non-volatile technology enabling instant power-up operation without external configuration memory
• Supports bank-selectable I/O voltages allowing mixed-voltage operation across up to four banks per chip
• Includes Clock Conditioning Circuits (CCC) with integrated Phase-Locked Loops (PLL) for advanced clock management
• Features high-performance routing hierarchy with segmented structure and support for hot-swappable I/Os

Field Programmable Gate Array Applications

• Instant-on embedded control systems requiring immediate operational readiness upon power application
• Industrial automation interfaces utilizing mixed-voltage signaling standards
• Secure communication gateways leveraging on-chip AES decryption capabilities
• Space-constrained designs benefiting from low-profile BGA packaging and single-chip integration

Field Programmable Gate Array Procurement Notes

Verify the specific suffix designation against official Microsemi documentation to confirm package type and temperature grade. Confirm RoHS compliance status as some variants within this family may differ. Check for Product Change Notifications (PCNs) regarding manufacturing site or material updates. Ensure design-in compatibility with current EDA tools supporting the ProASIC3L architecture. Validate supply chain authenticity through authorized distributors.

Field Programmable Gate Array Selection Notes

Select this component when non-volatile configuration and instant-on capability are required to eliminate external boot devices. Compare gate density and I/O count against standard ProASIC3 models if higher performance is needed. Consider the ProASIC3L series specifically for lower power consumption requirements compared to the standard ProASIC3 line. Verify that the 256-pin LBGA footprint fits the target PCB layout constraints.

Field Programmable Gate Array Part Context

This part belongs to the ProASIC3L Flash FPGA family, which is optimized for low-power applications compared to the standard ProASIC3 series. The family offers reprogrammable flash technology with capacities ranging from 15k to 1M system gates. The A3P250L variant sits in the mid-range of this portfolio, balancing logic capacity with power efficiency for embedded applications.

Field Programmable Gate Array Replacement Considerations

Direct pin-compatible replacements exist within the same ProASIC3L family, such as the A3P250L-FGG144 for smaller footprints or higher-density parts like the A3P500L-FGG256 for increased logic resources. Standard ProASIC3 counterparts like the A3P250-FGG256 offer similar functionality but with different power characteristics.