A3P250L-FGG256I

Field Programmable Gate Array Overview

The A3P250L-FGG256I is a Field Programmable Gate Array (FPGA) belonging to the ProASIC3L family, manufactured by Microsemi Corporation. It features 250,000 system gates and 1,920 Configurable Logic Blocks (CLBs). The device includes 73,728 bits of embedded SRAM and supports up to 145 user I/Os. It operates within a supply voltage range of 1.14V to 1.575V and functions across an industrial temperature range of -40°C to +85°C. The component is housed in a 256-pin Low-Profile Ball Grid Array (LBGA) package with dimensions of 17mm x 17mm.

Field Programmable Gate Array Feature Summary

• Utilizes low-power flash technology for non-volatile configuration without external memory requirements.
• Supports Live at Power-Up (LAPU) functionality for immediate design execution upon power application.
• Enables mixed-voltage I/O operation with bank-selectable standards including LVCMOS and LVTTL.
• Integrates Clock Conditioning Circuits (CCC) and Phase-Locked Loops (PLL) for signal management.

Field Programmable Gate Array Applications

• Industrial automation control systems requiring deterministic boot times.
• Telecommunications infrastructure utilizing high-speed serial interfaces.
• Medical imaging equipment demanding reliable, radiation-tolerant logic processing.
• Automotive electronics operating under extended temperature conditions.

Field Programmable Gate Array Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +85°C) against the manufacturer's official datasheet. Confirm the package type matches the 256-pin LBGA specification. Ensure compliance with RoHS directives if required for the target assembly process. Cross-reference the full part number with authorized distributors to avoid obsolete or counterfeit components.

Field Programmable Gate Array Selection Notes

Select this model when non-volatile flash-based FPGA architecture is preferred over volatile SRAM-based alternatives. Consider the 250k gate count and 73kb SRAM capacity for moderate complexity logic designs. Evaluate the 1.5V core voltage requirements against available power rails. Compare pin counts and I/O flexibility against other members of the ProASIC3L family for optimal footprint utilization.

Field Programmable Gate Array Part Context

This component is part of the ProASIC3L family, which represents a low-power evolution of the ProASIC3 line. It shares architectural similarities with the standard ProASIC3 devices but focuses on reduced power consumption while maintaining flash-based non-volatility. The device serves as a bridge between discrete logic solutions and complex SoC FPGAs.

Field Programmable Gate Array Replacement Considerations

Direct pin-compatible replacements within the same family include the A3P250L-FFG256I. Higher capacity options such as the A3P400L-FGG256I may be suitable if additional logic resources are needed. Verify that any substitute maintains the same LBGA256 package and industrial temperature rating.