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A3P400-1FGG484 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microsemi Corporation. Its product description is IC FPGA 194 I/O 484FBGA. Review the specifications below when checking this part for your BOM.
The A3P400-1FGG484 is a ProASIC3 Flash Field Programmable Gate Array manufactured by Microsemi. It features 400,000 system gates and 9,216 VersaTiles within a 484-pin Fine Pitch Ball Grid Array (FBGA) package with a 1.0 mm pitch. The device supports a maximum operating frequency of 272 MHz and operates on a 1.5 V core voltage. It includes up to 54 kbits of embedded SRAM and 1 kbit of nonvolatile FlashROM. The industrial temperature grade (-I suffix) ensures operation between -40°C and +100°C.
Verify the specific speed grade '1' and industrial temperature range '-I' against project requirements. Confirm that the FBGA-484 footprint matches the PCB layout. Ensure design tools support the ProASIC3 family for configuration and programming.
Select this model for designs requiring 400k gates with industrial temperature tolerance. Compare gate density and I/O counts against A3P250 or A3P600 if resource constraints exist. Verify compatibility with existing JTAG programming infrastructure.
This component belongs to the ProASIC3 Flash Family, which bridges the gap between standard FPGAs and ASICs. It offers reprogrammability with nonvolatile storage, distinguishing it from SRAM-based counterparts like the PolarFire series.
A3P400-2FGG484I: Higher speed grade variant.
No, the nonvolatile flash technology allows the device to retain its configuration when powered off, eliminating the need for external boot PROMs.
The FG484 package supports up to 194 user I/Os for the A3P400 device.
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