A3P400-1FGG484I

Field Programmable Gate Array Overview

The A3P400-1FGG484I is a ProASIC3 Flash Field Programmable Gate Array manufactured by Microsemi. It features 400,000 system gates and 9,216 VersaTiles within a 484-pin Fine Pitch Ball Grid Array (FBGA) package measuring 23 mm x 23 mm. The device operates at a maximum frequency of 350 MHz with a core voltage range of 1.425 V to 1.575 V. It supports up to 194 user I/Os across four banks and includes 54 kbits of embedded dual-port SRAM. The industrial temperature grade (-40°C to +100°C) ensures reliable operation in demanding environments.

Field Programmable Gate Array Feature Summary

• Nonvolatile flash-based architecture providing instant-on functionality without external configuration memory
• Integrated AES decryption engine for secure in-system programming and intellectual property protection
• Flexible I/O structure supporting mixed-voltage standards including LVDS and DDR capabilities
• Embedded clock conditioning circuits with phase-locked loop for precise timing management

Field Programmable Gate Array Applications

• Secure networking and communications equipment requiring encrypted data transmission
• Industrial control systems needing instant power-up and high reliability
• Avionics applications utilizing nonvolatile logic with radiation hardness characteristics
• Consumer electronics requiring low-power reprogrammable logic solutions

Field Programmable Gate Array Procurement Notes

Verify the specific speed grade suffix '1' corresponds to the required performance metrics for your design. Confirm that the industrial temperature rating 'I' aligns with your operational environment specifications. Ensure compatibility with existing PCB footprints as the FG484 package dimensions are standardized within the family. Check for current lifecycle status as flash FPGA availability may vary by region.

Field Programmable Gate Array Selection Notes

Select this model when designs require 400,000 system gates with industrial temperature tolerance. Consider the FBGA-484 package if higher pin counts and thermal performance are necessary compared to smaller packages. Evaluate the 350 MHz speed grade against timing constraints before choosing faster or slower variants. Verify that the 194 available I/Os meet interface requirements for the target application.

Field Programmable Gate Array Part Context

This component belongs to the ProASIC3 Flash family, representing third-generation technology from Microsemi. It bridges the gap between standard FPGAs and ASICs by offering nonvolatility and lower unit costs. The A3P400 density level provides substantial logic resources while maintaining manageable power consumption and board space requirements for mid-range applications.

Field Programmable Gate Array Replacement Considerations

Direct pin-compatible replacements within the same package include other A3P400 speed grades or adjacent densities like A3P250 or A3P600 if logic resources allow. Cross-family migration to ProASIC3E may offer enhanced features but requires schematic and layout verification.