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A3P400-2FG484I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microsemi Corporation. Its product description is IC FPGA 194 I/O 484FBGA. Review the specifications below when checking this part for your BOM.
The A3P400-2FG484I is a ProASIC3 Flash Field Programmable Gate Array manufactured by Microsemi. It features 400,000 system gates and 9,216 VersaTiles within a 484-pin Fine Pitch Ball Grid Array (FG484) package with a 1.0 mm pitch. The device operates at a maximum frequency of 350 MHz and supports up to 194 user I/Os. It utilizes a 130-nm flash-based CMOS process, providing nonvolatile configuration without external boot PROMs. The part includes embedded SRAM blocks, Clock Conditioning Circuits (CCC), and an integrated Phase-Locked Loop (PLL). It is rated for industrial temperature ranges from -40°C to +100°C.
Verify the specific speed grade suffix '2' against the manufacturer's current production status, as older ProASIC3 variants may have limited availability or require confirmation of lead times directly with Microchip Technology distributors. Ensure the FG484 package footprint compatibility is confirmed for the target PCB design.
Select this component for designs requiring nonvolatile FPGA logic with high security and instant-on capabilities. Compare the 400,000 gate density against the A3P250 and A3P600 models to ensure optimal resource utilization. Verify that the 194 available I/Os meet the interface requirements and that the industrial temperature range aligns with the environmental specifications.
This device belongs to the ProASIC3 Flash family, which bridges the gap between CPLDs and complex FPGAs. It offers reprogrammability similar to SRAM-based FPGAs but with the nonvolatility of ASICs. The family supports optional ARM Cortex-M1 soft processors in higher-density variants, though the A3P400 focuses on pure logic and memory resources.
The A3P400-1FGG484I serves as a standard commercial-grade alternative with identical pinout and functionality but a lower operating temperature range. For migration to newer technologies, the SmartFusion or IGLOO families offer comparable densities with updated process nodes.
No, the device uses nonvolatile flash technology, allowing it to be Instant On without external configuration components.
The device supports a maximum system performance of 350 MHz.
The device contains six CCC blocks, one of which includes an integrated PLL.
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