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A3P400-FGG484 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microsemi Corporation. Its product description is IC FPGA 194 I/O 484FBGA. Review the specifications below when checking this part for your BOM.
The A3P400-FGG484I is a ProASIC3 Flash Field Programmable Gate Array manufactured by Microsemi. It features 400,000 system gates and 9,216 VersaTiles. The device operates within an industrial temperature range of -40°C to +100°C. It utilizes a Fine Pitch Ball Grid Array (FG) package with 484 pins and a 1.0 mm pitch. The maximum operating frequency is 350 MHz. It includes 54 kbits of embedded SRAM organized in 12 blocks of 4,608 bits each. The core voltage is 1.5 V, supporting mixed-voltage I/O standards.
Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +100°C). Confirm the FG package type matches the required footprint. Check for RoHS compliance status as indicated in ordering information. Ensure design tools support the ProASIC3 family for configuration.
Select this model for applications requiring nonvolatile FPGA functionality with high security features. Compare gate density against A3P250 or A3P600 if resource constraints exist. Consider the M1A3P400 variant if ARM Cortex-M1 processor integration is needed. Verify I/O bank voltage requirements match the supported standards.
This component belongs to the ProASIC3 Flash Family, representing third-generation flash FPGAs from Microsemi. It offers a balance of density and performance with integrated security. The family supports various packages, with the FG484 providing high pin counts for complex designs.
Publicly confirmed substitutes are not available in the provided documentation. Migration to higher density devices like A3P600 requires verification of pin compatibility and resource utilization.
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