A3P400-FGG484I

Field Programmable Gate Array Overview

The A3P400-FGG484I is a ProASIC3 Flash Field Programmable Gate Array manufactured by Microsemi. It features 400,000 system gates and 9,216 VersaTiles within a 484-pin Fine Pitch Ball Grid Array (FGG484) package. The device supports a maximum operating frequency of 350 MHz and includes 54 kbits of embedded dual-port SRAM alongside 1 kbit of nonvolatile FlashROM. It operates at a core voltage of 1.5 V with an industrial temperature range spanning from -40°C to +100°C.

Field Programmable Gate Array Feature Summary

• Nonvolatile flash-based architecture providing instant-on capability without external configuration memory
• Integrated AES decryption engine for secure in-system programming and intellectual property protection
• Flexible I/O structure supporting mixed-voltage operation across 1.5 V, 1.8 V, 2.5 V, and 3.3 V standards
• Advanced clock conditioning circuits including six CCC blocks with one integrated PLL

Field Programmable Gate Array Applications

• Secure remote field updates over public networks
• Systems requiring immediate power-up execution before processor initialization
• Applications needing high-density logic with low static power consumption
• Industrial control environments requiring extended temperature stability

Field Programmable Gate Array Procurement Notes

Verify the specific speed grade suffix associated with the part number to ensure timing requirements are met. Confirm that the industrial temperature rating aligns with the operational environment specifications. Ensure compatibility with the Libero SoC design tools for programming and configuration management.

Field Programmable Gate Array Selection Notes

Select this component when a single-chip solution eliminating external boot PROMs is required. Consider the 400,000 gate capacity for complex logic designs. Evaluate the 1.5 V core voltage against system power constraints. Verify pin compatibility if migrating from other ProASIC3 family devices.

Field Programmable Gate Array Part Context

This device belongs to the ProASIC3 Flash Family, representing third-generation technology from Microsemi. It succeeds earlier families like ProASICPLUS by offering higher density and enhanced security features. The FGG484 package provides a footprint-compatible option within the fine-pitch BGA series for high-pin-count applications.

Field Programmable Gate Array Replacement Considerations

Footprint-compatible packages include FG256. Higher density alternatives within the same family include the A3P600 and A3P1000. For designs requiring ARM Cortex-M1 support, consider the M1A3P400 variant.