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A3P600-1FG256I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC FPGA 177 I/O 256FBGA. Review the specifications below when checking this part for your BOM.
The A3P600-1FG256I is a Field Programmable Gate Array (FPGA) belonging to the ProASIC3 Flash family. It features 13,824 Configurable Logic Blocks (CLBs) and approximately 600,000 system gates. The device supports a maximum operating frequency of 350 MHz and includes up to 144 kbits of True Dual-Port SRAM. It operates within a supply voltage range of 1.425 V to 1.575 V and functions across an industrial temperature range of -40°C to +100°C. The component utilizes a 256-pin FineLine BGA package with dimensions of 17 mm x 17 mm.
Verify the specific suffix '1' indicates the speed grade corresponding to the 350 MHz performance rating. Confirm that the FG256 designation matches the required 256-pin FineLine BGA footprint for PCB layout compatibility. Ensure the 'I' suffix aligns with the specified industrial temperature range requirements for the target application environment.
Select this model when non-volatile storage and immediate operational readiness are critical. Compare against the A3PE600 series if lower power consumption during active reconfiguration is required. Verify that the available I/O count meets interface requirements, as pin counts vary significantly across different package options within the same logic density family.
This component is part of the Microchip ProASIC3 Flash FPGA portfolio, which bridges the gap between ASICs and traditional SRAM-based FPGAs. The family emphasizes low power consumption and security features. The A3P600 variant provides mid-range logic capacity suitable for complex digital logic implementations without the overhead of volatile configuration storage.
Direct pin-compatible replacements within the same package include other variants from the A3P600 series, such as the A3P600-FGG256I or A3P600-FFG256, provided their speed grades meet the timing constraints. Cross-family migration requires careful review of I/O mapping and power delivery specifications.
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